The effects of plasma treatment of polyimide surface on the adhesion of chromium/polyimide

크롬/폴리이미드의 접착력에 미치는 폴리이미드 표면의 플라즈마 처리의 효과

  • Chung, Tae-Gyeong (Dept. of Electronic Materials Engineering, KAIST) ;
  • Kim, Young-Ho (Dept. of Materials Engineering, Hanyang University) ;
  • Yu, Jin (Dept. of Electronic Materials Engineering, KAIST)
  • 정태경 (한국과학기술원 전자재료공학과) ;
  • 김영호 (한양대학교 재료공학과) ;
  • 유진 (한국과학기술원 전자재료공학과)
  • Published : 1993.04.01


Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.