- Volume 5 Issue 3 Serial No. 16
이송 모듈을 사용한 리플로우 오븐의 열유동해석
Thermal design of reflow oven with PCB-module
- Jeong, Won-Jung (Graduate School of Mechanical Engineering, Yonsei University) ;
- Kwon, Hyun-Goo (Graduate School of Mechanical Engineering, Yonsei University) ;
- Cho, Hyung-Hee (School of Mechanical Engineering, Yonsei University)
- 발행 : 2006.09.30
Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.