The Low Height Looping Technology for Multi-chip Package in Wire Bonder

와이어 본더에서의 초저 루프 기술

  • Kwak, Byung-Kil (Precision Instruments R&D Center, Sam sung Techwin Co., LTD) ;
  • Park, Young-Min (Precision Instruments R&D Center, Sam sung Techwin Co., LTD) ;
  • Kook, Sung-June (Semiconductor System Division, Sam sung Techwin Co., LTD)
  • 곽병길 (삼성테크윈 정밀기기연구소) ;
  • 박영민 (삼성테크윈 정밀기기연구소) ;
  • 국성준 (삼성테크윈 반도체시스템사업부)
  • Published : 2007.03.31


Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.