The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.