Effects of Pressurization Conditions on the Pattern Transfer in the Thermal Nanoimprint Lithography

열 나노임프린트 공정에서 가압조건이 패턴전사에 미치는 영향

  • Lee, Woo Young (School of Mechanical Engineering, Korea University of Technology and Education) ;
  • Lee, Ki Yeon (Department of Mechanical Engineering, Soonchunhyang University) ;
  • Kim, Kug Weon (Department of Mechanical Engineering, Soonchunhyang University)
  • 이우영 (한국기술교육대학교 기계공학부) ;
  • 이기연 (순천향대학교 공과대학 기계공학과) ;
  • 김국원 (순천향대학교 공과대학 기계공학과)
  • Received : 2013.11.05
  • Accepted : 2013.11.30
  • Published : 2013.12.31


Nanoimprint lithography (NIL) is the next generation photolithography process in which the photoresist is dispensed onto the substrate in its liquid form and then imprinted and cured into a desired pattern instead of using traditional optical system. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. In this paper, a pressure vessel type imprinting system was used to imprint patterns with two type pressure values (25 bar, 30 bar) and two type pressure keeping times (5 min, 10 min). The height of transferred pattern and the thickness of residual layer were measured and effects of pressurization conditions - pressure and pressure keeping time - on the pattern transfer in thermal NIL were investigated.



Supported by : 한국연구재단


  1. Chou, S., and Krauss, P., "Imprint Lithography with Sub-10nm Feature Size and High Throughput," Microelectronic Engineering, Vol. 35, pp. 237-240, 1997. https://doi.org/10.1016/S0167-9317(96)00097-4
  2. Guo, L.J., "Recent progress in nanoimprint technology and its applications," Journal of Physics D: Applied Physics, Vol. 37, pp. R123-R141, 2004. https://doi.org/10.1088/0022-3727/37/11/R01
  3. Young, W.B., "Analysis of the nanoimprint Lithography with a Viscous Model," Microelectronic Engineering, Vol. 77, pp.405-411, 2005. https://doi.org/10.1016/j.mee.2005.01.024
  4. Rowland, H.D., and King, W. P., "Polymer Deformation and Filling Modes during Microembossing," Journal of Micromechanics and Microengineering, Vol. 14, pp. 1625-1632, 2004. https://doi.org/10.1088/0960-1317/14/12/005
  5. Heyderman, L.J., Schift, H., David, C., Gobrecht, J., and Schweizer, T., "Flow behavior of thin polymer films used for hot embossing lithography," Microelectronic Engineering, Vol. 54, pp.229-245, 2000. https://doi.org/10.1016/S0167-9317(00)00414-7
  6. Kim, K.W., Noorani, R.I., and Kim, N.W., "A study on the uniformity improvement of residual layer of a large area nanoimprint lithography," Journal of the Semiconductor & Display Technology, Vol. 9, No. 4, pp.19-23, 2010.