Nano Crystalline Change by Heat Treatment

  • Sun, Yong-Bin (Semiconductor-Display-Mechatronics Program, GS_CEI, Kyonggi University)
  • Received : 2013.12.03
  • Accepted : 2013.12.16
  • Published : 2013.12.31

Abstract

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

Keywords

Acknowledgement

Supported by : Kyonggi University

References

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