Nano Crystalline Change by Heat Treatment

  • Sun, Yong-Bin (Semiconductor-Display-Mechatronics Program, GS_CEI, Kyonggi University)
  • Received : 2013.12.03
  • Accepted : 2013.12.16
  • Published : 2013.12.31


Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.



Supported by : Kyonggi University


  1. Y.B. Sun, Adhesion Mechanism at Metal-Organic Interface Modified by Plasma, Materials Transactions, 44(2003), 1636-1639
  2. Uwe Erb and Karl T. Aust, Electrodeposited Nanocrystalline Metals, Alloys, and Composites, Nanostructured Materials, Noyes Publications, Ch.5 (2002) 179-222
  3. El-Sherik, J. Shirokoff, U. Erb, Stress measurements in nanocrystalline Ni electrodeposits, J. Allloys and Compounds, 389(2005) 140-143
  4. N. Wang, Z. Wang, K. Aust, U. Erb, Isokinetic analysis of nanocrystalline Nickel electrodeposits upon annealing, Acta Mater., 45(1997) 1655-1669