Nano Crystalline Change by Heat Treatment

  • Sun, Yong-Bin (Semiconductor-Display-Mechatronics Program, GS_CEI, Kyonggi University)
  • 투고 : 2013.12.03
  • 심사 : 2013.12.16
  • 발행 : 2013.12.31

초록

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

키워드

과제정보

연구 과제 주관 기관 : Kyonggi University

참고문헌

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