정전척 표면의 세라믹물질 적층 순서에 따른 온도 특성에 관한 연구

A Study on Temperature Characteristics according to Ceramic Material Stacking Sequence of Electrostatic Chuck Surface

  • 장경민 (한국기술교육대학교 대학원 메카트로닉스공학과) ;
  • 김광선 (한국기술교육대학교 메카트로닉스공학부)
  • Jang, Kyungmin (Graduate School of Mechatronics Engineering, Koreatech) ;
  • kim, Kwangsun (School of Mechatronics Engineering, Koreatech)
  • 투고 : 2017.09.15
  • 심사 : 2017.09.25
  • 발행 : 2017.09.30

초록

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

키워드

과제정보

연구 과제 주관 기관 : 한국산업기술평가원

참고문헌

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