• Title/Summary/Keyword: Ni-P plating

Search Result 17, Processing Time 0.058 seconds

Catalytic Oxidation of Toluene Using NiO Filter Supported on Carbon Fiber

  • Sim, Jong Ki;Seo, Hyun Ook;Jeong, Myung-Geun;Kim, Kwang-Dae;Nam, Jong Won;Kim, Young Dok;Lim, Dong Chan
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • /
    • pp.217-217
    • /
    • 2013
  • Carbon-fiber-supported NiO catalytic filters for oxidation of volatile organic compounds were prepared by electroless Ni-P plating and subsequent annealing processes. Surface structure and crystallinity of NiO film on carbon fiber could be modified by post-annealing at different temperatures (500 and $650^{\circ}C$. Catalytic thermal decompositions of toluene over these catalytic filters were investigated. $500^{\circ}C$ annealed sample showed a higher catalytic reactivity toward toluene decomposition than $650^{\circ}C$ annealed one under same conditions, despite of its lower surface area and toluene adsorption capacity. X-ray diffraction and X-ray photoelectron spectroscopy studies suggested that amorphous structures of NiO on $500^{\circ}C$ annealed catalyst caused the higher reactivity for oxidation of toluene than that of $650^{\circ}C$ annealed sample with a higher crystallinity.

  • PDF

A Study on the Functional Electroless Ni Plating for Controled Morphology on the CBN Powder (CBN분말상에 석출형상 제어를 위한 무전해 기능성 니켈합금도금에 관한 연구)

  • Chu, H.S.;Kim, D.K.
    • Journal of the Korean institute of surface engineering
    • /
    • v.41 no.6
    • /
    • pp.312-324
    • /
    • 2008
  • In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

Thermal Cycle Reliabilties and Cracking Characteristics of Electroplated Cr/Ni-P Coatings (전해 Cr/Ni-P 도금막의 열 사이클 신뢰성 및 균열거동 분석)

  • Lee, Jina;Son, Kirak;Lee, Kyu Hwan;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.26 no.4
    • /
    • pp.133-140
    • /
    • 2019
  • The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

Research on the Solution and Properties of Ni-P/n-$Al_2O_3$ Electroless Composite Plating

  • Huang, Yan-bin;Liu, Fei-fei;Zhang, Qi-yong;Ba, Guo-zhao;Liang, Zhi-jie
    • Corrosion Science and Technology
    • /
    • v.6 no.5
    • /
    • pp.257-260
    • /
    • 2007
  • In order to further improve the corrosion resistance and wear resistance of the Ni-P coatings of electroless plating, electroless Ni-P/n-$Al_2O_3$ composite deposits were prepared by adding some nano $Al_2O_3$ Particles in Ni-P plating bath. The bath composition and proproties were studied in this paper. The orthogonal test was applied in order to get the new composite solution, taking the initial stable potential as evaluation standard and considering the elements correlation at the same time. The processing parameters have been optimized by single factor experiment in which the depositing speed was chosen as the evaluation standard. The results showed that the process is stable and the composite Ni-P/n-$Al_2O_3$ deposits werebright and smooth, whose hardness and corrosion resistance are much better than simple Ni-P coatings. Furthermore the surface appearance and structure of the composite Ni-P/n-$Al_2O_3$ coating were investigated by SEM and XRD method. It was proved that the coating surface is typical cystiform cells and its structure is amorphous. All test results ofcomposite coating showed that all various physical coating properties had been improved by adding nano-particles. The hardness of optimal coating is more than 600HV and increases to 1000HV after heat-treating, and its hardness is 20~50% higher than Ni-P coating. The rust points appeared in 200 hour by immersing the coating into the 10%HCl solution and the corrosive speed is $3{\times}10^{-3}mg/(cm^2{\cdot}h)$which was obtained after 300 hour. In the same condition Ni-P coating is $5.6{\times}10^{-3}mg/(cm^2{\cdot}h)$. The salt spray resistance of the layers can exceed 600h with the thickness $20{\mu}m$.

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation (ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 2. Pd 촉매 시간의 영향)

  • Huh, Seok-Hwan;Lee, Ji-Hye;Ham, Suk-Jin
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.21 no.3
    • /
    • pp.51-56
    • /
    • 2014
  • The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

Study on the Improvement of BGA Solderability in Electroless Nickel/Gold Deposit (무전해 Ni/Au 도금에서의 BGA Solderability 특성 개선에 관한 연구)

  • 민재상;황영호;조일제
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.8 no.3
    • /
    • pp.55-62
    • /
    • 2001
  • With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

  • PDF

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit (ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 1. 무전해 Ni-P도금의 두께와 표면거칠기의 영향)

  • Huh, Seok-Hwan;Lee, Ji-Hye;Ham, Suk-Jin
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.21 no.3
    • /
    • pp.43-50
    • /
    • 2014
  • By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.