• Title/Summary/Keyword: Polyimide

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Etching Characteristics of Polyimide Film as Interlayer Dielectric Using Inductively Coupled ($O_2/CF_4$)Plasma ($O_2/CF_4$ 유도결합 플라즈마를 이용한 Polyimide 박막의 식각 특성)

  • Kang, Pil-Seung;Kim, Chang-Il
    • Proceedings of the KIEE Conference
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    • pp.1509-1511
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    • 2001
  • In this study, etching characteristics of polyimide(Pl) film with $O_2/CF_4$ gas mixing ratio was studied using inductively coupled plasma (ICP). The etch rate and selectivity were evaluated to chamber pressure and gas mixing ratio. High etch rate (over 8000$\AA$/min) and vertical profile were acquired in $CF_4$/($CF_4+O_2$) of 0.2. The selectivities of polyimide to PR and polyimide to $SiO_2$ were 1.15, 5.85, respectively. The profiles of polyimide film etched in $CF_4/O_2$ were measured by a scanning electron microscope (SEM) with using an aluminum hard mask pattern. The chemical states on the polyimide film surface were measured by x-ray photoelectron spectroscopy (XPS).

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Electro-Optical Characteristics of Plastic STN Cell on the Polyimide Surface (폴리이미드 표면을 이용한 플라스틱 STN 셀의 전기 광학 특성)

  • Kim, Jong-Hwan;Kim, Kang-Woo;Hwang, Jeoung-Yeon;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.1086-1089
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    • 2003
  • We investigated the electro-optical (EO) performances of the super twisted nematic liquid crystal display (STN-LCD) on the polyimide (PI) surface using polymer film. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance (V-T) curve of the plastic STN-LCD was observed on the polyimide (PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide (PI) surfaces using polymer film can be achieved. Therefore, the EO performances of the plastic STN-LCD on the polyimide (PI) surfaces using polymer film is almost the same as that of the glass STN-LCD on a polyimide (PI) surface.

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Liquid Crystal Aligning Capabilities on Homeotropic Blending Polyimide Layer (수직 복합 폴리이미드층에서의 액정 배향 특성)

  • Hwang, Jeoung-Yeon;Seo, Dae-Shik;Kim, Jae-Hyung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.337-340
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    • 2001
  • The control of high pretilt angle far nematic liquid crystal (NLC) with negative dielectric anisotropy on the rubbed blending polyimide (homeotropic and homogeneous alignment) surface were studied. High NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-7492 surface was measured and the NLC pretilt angle increases with blending ratio and rubbing strength. However, the NLC pretilt angle generated on the blending polyimide (homeotropic polyimide and SE-150 surface was not varied. The high pretilt angle the NLC using blending polyimide surface can be acheived.

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Investigation of Polyimide Hydrolysis and Polyimide-Aluminum Interfaces (폴리이미드의 가수 분해와 Pl-알루미늄 계면 고찰)

  • Min, Nam-Ki;Chun, Jae-Hyung;Hong, Suk-In
    • Proceedings of the KIEE Conference
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    • pp.1216-1218
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    • 1997
  • Hydrolysis of BTDA-ODA: MPDA, PMDA-ODA, PIQ polyimides were investigated by FT-IR. The results showed that hydrolysis depends on structure of polyimide and that polyimide obtains hydrolytic stability by curing. Polyimide-aluminum interfaces were characterized by RAIR. It was concluded that imidization of the polyamic acid to polyimde was inhibited by interaction of acid groups with substrate to form aluminum carboxylate.

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Enhancement of Molecular Orientation of Liquid Crystal on Photoreactive Polymers by using Non-Photoreactive Naphthalenic Polyimide

  • Hah, Hyun-Dae;Sung, Shi-Joon;Cho, Ki-Yun;Kim, Won-Sun;Jeong, Yong-Cheol;Park, Jung-Ki
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.1169-1172
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    • 2004
  • Polyimides are blended with photoreactive polymers in order to improve the thermal stability of molecular orientation of photoreactive groups induced by polarized UV irradiation. The polyimide/photopolymer blends can be applied for the photo-induced liquid crystal alignment layers. However, the polyimides are also decomposed by UV irradiation and this may have the negative effect on the orientation of liquid crystals. In order to elucidate the influence of polyimide on the molecular orientation of liquid crystal, non-photoreactive naphthalenic polyimide (1,4,5,8-naphthalene tetracarboxylic dianhydride} was selected for the blend alignment layers. We prepared the blends of photo-reactive coumarin polymers and naphthalenic polyimide, and investigated the orientation of liquid crystals. Thermal stability of the orientation of liquid crystals was enhanced due to the thermally stable polyimide. However, there was no other side-effect of polyimide on the orientation of liquid crystals and this might be attributed to the non-photo-reactivity of naphtahlenic polyimide.

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A Study on the Preparation of the Exfoliated Polyimide Nanocomposite and Its Characterization (박리형 폴리이미드 나노복합재료 제조와 특성에 관한 연구)

  • 유성구;박대연;김영식;이영철;서길수
    • Polymer(Korea)
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    • v.26 no.3
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    • pp.375-380
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    • 2002
  • Diamines (p-phenylenediamine , m-phenylenediamine , and n-hexamethylenediamine) were intercalated into sodium montmorillonite for the further reaction with the anhydride end groups of polyamic acid. The anhydride terminated polyamic acid was synthesized using a mole ratio of 4,4'-oxydianilline : 1,2,4,5-benzene tetracarboxylic dianhydride = 1.50 : 1.53. The modified montmorillonite was reacted with polyamic acid terminated with anhydride group in N-methyl-2-pyrrolidone (polyamic acid/clay nanocomposite). After imidization, thin films of the polyimide/clay nanocomposite were prepared. From the results of XRD and TEM, we found that mono layered silicates were dispersed in polyimide matrix and those resultants were exfoliated nanocomposites. Mechanical properties of exfoliated polyimide nanocomposite were better than both those of pure polyimide and those of intercalated polyimide nanocomposite.

ENHANCED ADHESION STRENGTH OF Cu/polyimide AND Cu/Al/polyimide BY ION BEAM MIXING

  • G. S. Chang;Kim, T.G.;K. H. Chae;D. S. Zatespine;E.Z. Kurmaev;H. S.. Choe;Lee, Y.P.
    • Journal of the Korean Vacuum Society
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    • v.6 no.S1
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    • pp.122-126
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    • 1997
  • the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.

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Adhesion and Interface Chemical Reactions of Cu/CuO/Polyimide System (Cu/CuO/Polyimide 시스템의 접착 및 계면화학 반응)

  • Lee, K.W.;Chae, H.C.;Choi, C.M.;Kim, M.H.
    • Korean Journal of Materials Research
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    • v.17 no.2
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    • pp.61-67
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    • 2007
  • The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment (CF4플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구)

  • Park, Sung-Cheol;Cho, Su-Hwan;Jung, Hyun-Cheol;Joung, Jae-Woo;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.17 no.4
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    • pp.215-221
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    • 2007
  • The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

Adhesion Improvement of Polyimide Films via Alkali Surface Treatment (알카리 표면처리에 의한 폴리이미드 필름의 접착성 향상)

  • Kim, Seong-Hun;Park, Jae-Gi
    • Textile Science and Engineering
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    • v.34 no.3
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    • pp.178-184
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    • 1997
  • Wet process with KOH aqueous solutions was performed for the surface treatment of polyimide films. Surface energy and mechanical property of surface treated commercial polyimide films in wet process were investigated. The value of surface energy in wet process was increased rapidly at the beginning of treatment time. However, the tensile strength of the surface modified polyimide films were decreased with increasing treatment time The lap shear strength measurement revealed that the value of lap shear strength was increased in the beginning of treatment time. However the value of lap shear strength was decreased as treatment time goes by. It seems that irregular adhesion on the surface modified polyimide films in the pressing due to the excessive etching on the surface of polyimide films. The phenomena were confirmed by SEM. The factors of improvement of polyimide adhesion were the applied pressure for the bonding process, drying time after surface modification and surface energy as the index of surface polarity (The lap shear strength decrement with increasing treatment time is induced by the irregular adhesion of the excessively etched polyimide surfaces)