• Title/Summary/Keyword: SiON

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중성입자빔과 ICP 플라즈마로 성장시킨 SiON 박막의 특성 연구

  • Kim, Jong-Sik;Kim, Dae-Cheol;Lee, Bong-Ju;Yu, Seok-Jae;Lee, Seong-Eun;Park, Yeong-Chun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.237-237
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    • 2011
  • 본 연구에서는 중성입자빔과 일반적인 ICP 플라즈마를 이용하여 성장시킨 SiON 박막의 물리적 특성 및 전기적 특성을 비교하여 분석하였다. 중성입자빔 및 ICP 플라즈마를 이용하여 기판 온도 400$^{\circ}C$ 조건에서 공정 시간에 따라 각각의 SiON 박막을 성장시켰으며 SiON 박막에 metal insulator semiconductor(MIS) 구조를 만들어 capacitance-voltage (C-V), current-voltage (I-V) 특성, 박막 두께 및 박막 내의 질소 분포 등을 비교 분석하였다. 기판 온도 400$^{\circ}C$ 조건에서 형성시킨 중성입자빔 및 플라즈마-SiON 박막의 두께는 6.0~10.0 nm, 굴절률 (n)은 1.5~1.8이며, 유전 상수는 4.2~5.0이다. 중성입자빔 SiON 박막의 절연파괴 전압은 약 14 MV/cm 이며, 플라즈마-SiON 박막의 절연파괴전압은 약 9~11 MV/cm 수준으로 중성입자빔-SiON 박막에 비하여 낮은 수준이다. 따라서 중성입자빔을 이용하여 400$^{\circ}C$에서 하전 입자에 의한 손상이 없는 양질의 SiON 박막을 형성시킬 수 있었다.

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Low Index Contrast Planar SiON Waveguides Deposited by PECVD (PECVD 법에 의해 제작된 저굴절률 차이 평판 SiON광도파로)

  • Kim, Yong-Tak;Yoon, Seok-Gyu;Yoon, Dae-Ho
    • Journal of the Korean Ceramic Society
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    • v.42 no.3 s.274
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    • pp.178-181
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    • 2005
  • Silicon oxynitride (SiON) layers deposited upon a $SiO_2/Si$ buffer layer placed upon silicon wafers have been obtained by using PECVD from $SiH_4,\;N_2O$, and $N_2$. It can be seen that the refractive index, measured by using a prism coupler, for the SiON films can be varied between 1.4480 and 1.4958 at a wavelength of 1552 nm by changing the process parameters. Optical planar waveguides with a thickness of $6{\mu}m$ and a refractive index contrast ($\Delta$n) of $0.36\% have been deposited. Also, etching experiments were performed using ICP dry etching equipment on thick SiON films grown onto Si substrates covered by a thick $SiO_2$ buffer layer. A polarization maintaining single-mode fiber was used for the input and a microscope objective for the output at $1.55{\mu}m$. As a result, a low index contrast SiON based waveguide is fabricated with easily adjustable refractive index of core layer. It illustrates that the output intensity mode is a waveguiding single-mode.

Fabrication of high-refractive index difference SiON planar optical waveguide film using PECVD (PECVD를 이용한 고굴절률차 SiON 평면 광도파로 박막 제작)

  • Lee No-Do;Gu Yeong-Jin;Kim Yeong-Cheol;Seo Hwa-Il
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.211-215
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    • 2006
  • 평면 광도파로 코어로 사용되는 SiON (Silicon oxynitride)과 클래딩으로 사용되는 $SiO_2$ (Silicon oxide)의 굴절률 차이가 2.5 %인 고굴절률차 평면 광도파로용 SiON 박막을 PECVD (plasma enhanced chemical vapor deposition)로 제작하였다. PECVD에 사용된 가스는 $SiH_4,\;NH_3,\;N_{2}O$이고, Si 기판의 $SiO_2$ 막은 100 nm이다. 가스의 비율에 따라 SiON 막의 굴절률은 633 nm의 파장에서 1.476에서 1.777까지 변화하였다. 코어로 사용되는 SiON의 두께는 $2.5{\mu}m$이고 클래딩과의 굴절률 차이는 2.5 %였다.

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The study of SiON thin film for optical properties. (SiON 박막의 광학적 특성에 대한 연구)

  • Kim, D.H.;Im, K.J.;Kim, K.H.;Kim, H.S.;Sung, M.Y.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.247-250
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    • 2001
  • We studied optical properties of SiON thin-film in the applications of optical waveguide. SiON thin-film was grown in $300^{\circ}C$ by PECVD(plasma enhanced chemical vapor deposition) system. The change of SiON thin-film composition and refractive Index was studied as a function of varying $NH_3$ gas flow rate. As $NH_3$ gas flow rate was increased, Quantity of N and refractive index were increased at the same time. By the results, we could form the SiON thin-film to use of a waveguide with refractive index of 1.6. We analyzed the conditions of the thin-film with FTIR(fourier transform infrared) and OES (optical emission spectroscopy). N-H bonding($3390cm^{-1}$ ) can be removed by thermal annealing. And we could observe the SiH bonding state and quantity by OES analysis in $SiH_4$

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Fabrications and properties of MFIS capacitor using SiON buffer layer (SiON buffer layer를 이용한 MFIS Capacitor의 제작 및 특성)

  • 정상현;정순원;인용일;김광호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.70-73
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    • 2001
  • MFIS(Metal-ferroelectric-insulator- semiconductor) structures using silicon oxynitride(SiON) buffer layers were fabricatied and demonstrated nonvolatile memory operations. Oxynitride(SiON) films have been formed on p-Si(100) by RTP(rapid thermal process) in O$_2$+N$_2$ ambient at 1100$^{\circ}C$. The gate leakage current density of Al/SiON/Si(100) capacitor was about the order of 10$\^$-8/ A/cm$^2$ at the range of ${\pm}$ 2.5 MV/cm. The C-V characteristics of Al/LiNbO$_3$/SiON/Si(100) capacitor showed a hysteresis loop due to the ferroelectric nature of the LiNbO$_3$ thin films. Typical dielectric constant value of LiNbO$_3$ film of MFIS device was about 24. The memory window width was about 1.2V at the electric field of ${\pm}$300 kV/cm ranges.

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Silicon 기판과 SiON 박막 사이의 계면 결함 감소를 위한 $NH_3$ Plasma Treatment 방법에 관한 연구

  • Gong, Dae-Yeong;Park, Seung-Man;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.131-131
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    • 2011
  • 이종접합 태양전지 제작을 위해 기판의 buffer layer로 사용되는 기존의 a-Si 박막을 SiON 박막으로 대체하려는 연구가 진행 중이다. 기존의 a-Si 박막은 대면적에서 균일도를 담보하기 어렵고, 열적 안정성에 취약한 문제점이 있다. 이에 반해 SiON 박막은 일종의 화학 반응인 oxidation 방법으로 형성이 되기 때문에 막의 균일도를 담보 할 수 있고, $400^{\circ}C$이상의 온도에서 형성되기 때문에 열적 안정성이 우수한 장점이 있다. 이러한 장점에도 불구하고 기판위에 직접 형성이 되기 때문에 기판과 SiON 계면 사이의 pssivation이 무엇보다 중요하다. 본 연구에서는 비정질 실리콘 이종접합 태양전지에 적용키 위한 SiON 박막을 형성하고, 기판과 SiON 계면에서의 passivation 향상을 위한 계면 결함 감소에 대한 연구를 진행하였다. 실험을 위한 SiON 박막은 공정온도 $450^{\circ}C$, 공정압력 100 mTorr, 증착파워 120 mW/cm2에서 5분간 증착하였으며, 이때 50 sccm의 N2O 가스를 주입하였다. 증착된 박막은 2~4 nm의 두께로 증착이 되었으며, 1.46의 광학적 굴절률을 가지는 것으로 분석되었다. 계면의 결함을 줄이기 위해 PECVD를 이용한 NH3 plasma treatment를 실시하였다. 공정온도 $400^{\circ}C$, 공정압력 150mTorr~450 mTorr, 플라즈마 파워 60mW/cm2에서 30분간 진행하였으며, 50 sccm의 N2O 가스를 주입하였다. 계면의 결함이 줄었는지 확인하기 위해 C-V 측정을 위한 시료를 제작하여 분석을 하였다. 실험 결과 VFB가 NH3 plasma treatment 이후 positive 방향으로 shift 됨을 알 수 있었다. Dit 분석을 통해 공정 압력 450 mTorr에서 $4.66{\times}108$[cm2/eV]로 가장 낮은 계면 결함 밀도를 확인 할 수 있었다. 결과적으로 NH3 plasma 처리를 통해 positive charge를 갖는 N-content가 형성되었음을 예측해 볼 수 있으며, N-content가 증가하면, 조밀한 Si-N 결합을 형성하면서, boron 및 phosphorus diffusion을 막는데 효과적이다. 또한, plasma treatment 과정에서 H-content에 의한 passivation 효과를 기대할 수 있다.

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The Effect of RF Power and $SiH_4$/($N_2$O+$N_2$) Ratio in Properties of SiON Thick Film for Silica Optical Waveguide (실리카 광도파로용 SiON 후막 특성에서 RF Power와 $SiH_4$/($N_2$O+$N_2$) Ratio가 미치는 영향)

  • 김용탁;조성민;서용곤;임영민;윤대호
    • Journal of the Korean Ceramic Society
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    • v.38 no.12
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    • pp.1150-1154
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    • 2001
  • Silicon oxynitride (SiON) thick films using the core layer of silica optical waveguide have been deposited on Si wafer by PECVD at low temperature (32$0^{\circ}C$) were obtained by decomposition of appropriate mixture of (SiH$_4$+$N_2$O+$N_2$) gaseous mixtures under RF power and SiH$_4$/($N_2$O+$N_2$) ratio deposition condition. Prism coupler measurements show that the refractive indices of SiON layers range from 1.4663 to 1.5496. A high SiH$_4$/($N_2$O+$N_2$) of 0.33 and deposition power of 150 W leads to deposition rates of up to 8.67 ${\mu}{\textrm}{m}$/h. With decreasing SiH$_4$/($N_2$O+$N_2$) ratio, the SiON layer become smooth from 41$\AA$ to 6$\AA$.

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A Study on the Thermal Stability of an Al2O3/SiON Stack Structure for c-Si Solar Cell Passivation Application (결정질 실리콘 태양전지의 패시베이션 적용을 위한 Al2O3/SiON 적층구조의 열적 안정성에 대한 연구)

  • Cho, Kuk-Hyun;Chang, Hyo Sik
    • Journal of the Korean Ceramic Society
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    • v.51 no.3
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    • pp.197-200
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    • 2014
  • We investigated the influence of blistering on $Al_2O_3$/SiON stacks and $Al_2O_3$/SiNx:H stacks passivation layers. $Al_2O_3$ film provides outstanding Si surface passivation quality. $Al_2O_3$ film as the rear passivation layer of a p-type Si solar cell is usually stacked with a capping layer, such as $SiO_2$, SiNx, and SiON films. These capping layers protect the thin $Al_2O_3$ layer from an Al electrode during the annealing process. We compared $Al_2O_3$/SiON stacks and $Al_2O_3$/SiNx:H stacks through surface morphology and minority carrier lifetime after annealing processes at $450^{\circ}C$ and $850^{\circ}C$. As a result, the $Al_2O_3$/SiON stacks were observed to produce less blister phenomenon than $Al_2O_3$/SiNx:H stacks. This can be explained by the differences in the H species content. In the process of depositing SiNx film, the rich H species in $NH_3$ source are diffused to the $Al_2O_3$ film. On the other hand, less hydrogen diffusion occurs in SiON film as it contains less H species than SiNx film. This blister phenomenon leads to an increase insurface defect density. Consequently, the $Al_2O_3$/SiON stacks had a higher minority carrier lifetime than the $Al_2O_3$/SiNx:H stacks.

The study of SiON thin film for optical properlies (SiON 박막의 광학적 특성에 대한 연구)

  • 김도형;임기주;김기현;김현석;김상식;성만영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.247-250
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    • 2001
  • We studied optical properties of SiON thin-film in the applications of optical waveguide. SiON thin-film was grown in 300$^{\circ}C$ by PECVD(plasma enhanced chemical vapor deposition) system. The change of SiON thin-film composition and refractive Index was studied as a function of varying NH$_3$ gas flow rate. As NH$_3$ gas flow rate was increased, Quantity of N and refractive index were increased at the same time. By the results, we could form the SiON thin-film to use of a waveguide with refractive index of 1.6. We analyzed the conditions of the thin-film with FTIR(fourier transform infrared) and OES(optical emission spectroscopy). N-H bonding(3390cm$\^$-1/) can be removed by thermal annealing. And we could observe the SiH bonding state and quantity by OES analysis in SiH$_4$

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SiON/SiO2 Multilayer Deposited by PECVD for Low-Loss Waveguides (저손실 광도파로 제작을 위해 PECVD 법에 의해 증착된 SiON/SiO2 다층박막)

  • 김용탁;김동신;윤대호
    • Journal of the Korean Ceramic Society
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    • v.41 no.3
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    • pp.197-201
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    • 2004
  • SiO$_2$ and SiON thick films were deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) technique on silicon wafer (100) using SiH$_4$ and $N_2$O as precursor gases. In this work, the influence of rf power, and rf bias power on the optical and physical properties of SiO$_2$ and SiON thick films is presented. The refractive index decreases with increasing rf power, and rf bias power. The refractive index of the films varied from 1.4493 to 1.4952 at wavelength at 1552 nm, with increasing rf power, the nitrogen content decreases while the oxygen content increases, in a manner that the O/N ratio increases approximately linearly.