• Title/Summary/Keyword: Soldering process

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Soldering Process of Au Bump using Longitudinal Ultrasonic (종방향 초음파를 이용한 Au 범프의 솔더링 공정)

  • 김정호;이지혜;유중돈;최두선
    • Journal of Welding and Joining
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    • v.22 no.1
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    • pp.65-70
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    • 2004
  • A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

Study on Vibration and Thermal Characteristics Applying Staking to CCGA Package for Space Applications (우주용 CCGA에서 Staking 적용에 따른 진동 및 열 특성 연구)

  • Jeong, Myung Deuk;Jung, Sunghoon;Hong, Young Min
    • Journal of the Korea Institute of Military Science and Technology
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    • v.23 no.6
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    • pp.574-581
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    • 2020
  • This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

Modeling of Soldering Process using Longitudinal Ultrasonic (종방향 초음파를 이용한 솔더링 공정의 모델링)

  • 김정호;이지혜;유중돈;최두선
    • Journal of Welding and Joining
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    • v.21 no.5
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    • pp.534-539
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    • 2003
  • An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

Characterization of Soldering Property on Heating Condition by Infrared Lamp Soldering Process for C-Si Photovoltaic Modules (적외선 램프 가열방식을 이용한 태양전지 셀의 솔더링 공정 및 열처리 조건 별 특성 평가)

  • Son, Hyoun Jin;Lee, Jung Jin;Kim, Sung Hyun
    • Current Photovoltaic Research
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    • v.4 no.2
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    • pp.59-63
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    • 2016
  • A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

Recent Research Trend in Laser-Soldering Process

  • Kim, Hwan Tae;Kil, Sang Cheol;Hwang, Woon Suk
    • Corrosion Science and Technology
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    • v.8 no.5
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    • pp.184-187
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    • 2009
  • The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

A study on the implementation of wave soldering process and the solder joint reliability of it using Sn-Cu-Ni lead-free solder (Sn-Cu-Ni계를 이용한 Pb-free wave Soldering의 공정 적용 및 신뢰성에 관한 연구)

  • 유충식;정종만;김진수;김미진
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.89-98
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    • 2001
  • Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

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Application of Stress Optimization for Preventing the Delamination of the Plastic IC Package in Reflow Soldering Process (리플로 납땜과정에서 플라스틱 IC 패키지의 박리방지를 위한 응력최적설계의 적용)

  • Kim, Geun-Woo;Lee, Kang-Yong;Kim, Ok-Whan
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.6
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    • pp.709-716
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    • 2004
  • In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

Temperature Uniformity Control of Wafer During Vacuum Soldering Process (진공 솔더링 공정 중 웨이퍼 온도균일화 제어)

  • Kang, Min Sig;Jee, Won Ho;Yoon, Wo Hyun
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.2
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    • pp.63-69
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    • 2012
  • As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

A Study on the Element Technology for PV Module Manufacturing (태양전지모듈 제조를 위한 요소기술연구)

  • Kang, Gi-Hwan;Yu, Gwon-Jong;Park, Kyung-Un;Ahn, Hyung-Keun;Han, Deuk-Young
    • Proceedings of the KIEE Conference
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    • pp.1365-1367
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    • 2003
  • In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

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Study on Joining Strength Improvement of Solder Joint with Pb Free Solder (Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구)

  • 신영의;김영탁
    • Journal of Welding and Joining
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    • v.15 no.2
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    • pp.36-42
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    • 1997
  • In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

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