• Title/Summary/Keyword: Wire bonder

Search Result 17, Processing Time 0.351 seconds

A study on the Robust Control Cain Selection Scheme of a High-Speed/High-Accuracy position Control System using Taguchi Method (다꾸지 방법을 이용한 고속/정밀 위치제어시스템의 강인한 제어게인 선정에 관한 연구)

  • 신호준;채호철;윤석찬;장진희;한창수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • /
    • pp.521-527
    • /
    • 2002
  • This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

  • PDF

A Study on the PID Control Gain Selection Scheme of a High-Speed/High-Accuracy position Control System using Taguchi Method (다구찌 방법을 이용한 고속/정밀 위치제어시스템의 PID 제어게인 선정에 관한 연구)

  • 신호준;채호철;한창수
    • Journal of the Semiconductor & Display Technology
    • /
    • v.1 no.1
    • /
    • pp.21-28
    • /
    • 2002
  • This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For modeling elements, the system is divided into electrical part, magnetic part, and mechanical part. Each part is modeled using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to obtain the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Results of simulations and experimental show that the designed PID controller provides a improved ratio of signal to noise and a reduced sensitivity improved to the conventional PID controller.

  • PDF

A Study on the Robust Control Gain Selection Scheme of a High-Speed/High-Accuracy Position Control System (고속/정밀 위치 제어 시스템의 강인한 제어게인 선정에 관한 연구)

  • Shin, Ho-Joon;Yun, Seok-Chan;Jang, Jin-Hee;Han, Chang-Soo
    • Proceedings of the KSME Conference
    • /
    • /
    • pp.747-753
    • /
    • 2001
  • This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

  • PDF

Vibration Characteristics of a Wire-Bonding Transducer Horn (와이어 본딩용 트랜스듀서 혼의 진동 특성)

  • Yim, Vit;Han, Dae-Ung;Lee, Seung-Yeop;An, Geun-Sik;Gang, Gyeong-Wan;Kim, Guk-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • /
    • pp.583-588
    • /
    • 2007
  • This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

  • PDF

A Study on the Modeling and Control of High-Speed/High-Accuracy Position Control System (고속/정밀 위치제어시스템의 모델인 및 제어에 관한 연구)

  • Park, Min-Gyu;Han, Chang-Soo
    • Journal of Institute of Control, Robotics and Systems
    • /
    • v.7 no.5
    • /
    • pp.399-406
    • /
    • 2001
  • This paper presents a dynamic modeling and a sliding mode controller for the high-speed/high-accuracy position control system. The selected target system is the wire bonder assembly which is used in the semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as an actuator and transducer horn as a bonding tool. For the modeling elements, the sys-tem is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

  • PDF

Contact Detection Algorithm of the Z-axis of a Wire Bonder (와이어 본더 시스템의 Z축 표면 접촉 검출 알고리듬 개발)

  • Kim Jung-Han
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.22 no.7
    • /
    • pp.137-145
    • /
    • 2005
  • A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. Fast and stable contact detection of the z-axis is extremely important fer maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70um. The new method is based on a statistical approach and designed for the discrete Kalman filter. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm.

A Study on the Modeling and Control of High-Speed/High-Accuracy Position Control System (고속/정밀 위치제어시스템의 모델링 및 제어에 관한 연구)

  • 신호준;박민규;윤석찬;한창수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • /
    • pp.83-89
    • /
    • 2000
  • This paper presents a dynamic modeling and a sliding mode controller for the high-speed / high-accuracy position control system. Selected target system is the wire bonder head assembly which is used in semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as a actuator and transducer horn as a bonding tool. For the modeling elements, the system is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled by using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

  • PDF

The Low Height Looping Technology for Multi-chip Package in Wire Bonder (와이어 본더에서의 초저 루프 기술)

  • Kwak, Byung-Kil;Park, Young-Min;Kook, Sung-June
    • Journal of the Semiconductor & Display Technology
    • /
    • v.6 no.1
    • /
    • pp.17-22
    • /
    • 2007
  • Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

  • PDF

Vibration Characteristics of a Wire-Bonding Piezoelectric Actuator (와이어 본딩용 압전 액츄에이터의 진동 특성)

  • Kim, Young-Woo;Kim, Kyoung-Up;Lee, Seung-Yop
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • /
    • pp.578-582
    • /
    • 2007
  • In this paper, vibration modes and frequencies of a ring-type stacked piezoelectric actuator for a wire bonding transducer system are analyzed using FEM simulations. We implement experiments using a commercial product model of the actuator PZT module which consists of 6 layer ring-type PZT and 7 electrodes, combined bolts, nut and tinut. There are two main results: One is that FEM analysis should consider the effect the harmonic voltage input in order to meet the experimental results. The other is that the current wire bonder using exciting frequency of 136 kHz should be modified in order to improve the actuator and bonding performance because the actuator module has the main longitudinal mode of 145 kHz.

  • PDF

Z-axis Contact Detection Algorithm for a Wire Bonder using a Discrete Kalman Filter

  • Kim, Jung-Han
    • International Journal of Precision Engineering and Manufacturing
    • /
    • v.8 no.1
    • /
    • pp.52-58
    • /
    • 2007
  • We propose a new contact detection algorithm for fine pitch wire bonding. Fast and stable contact detection of the z-axis in wire bonding is extremely important to maintain the quality of fine pitch gold wire bonding processes, which use a small pad less than $70{\mu}m$ in diameter. A small perturbation in the contact detection time causes a large difference in the size of the formed squashed ball. The new detection method is based on a statistical approach and designed for a discrete Kalman filter. It is faster and has smaller detection time variations than conventional detection methods. Experimental results are presented to demonstrate the advantages of the proposed algorithm.