• Title/Summary/Keyword: substrate handler

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Development of a Hybrid Substrate Handler for Precision Alignment (고정밀 얼라인을 위한 하이브리드 조작 장치의 개발)

  • Lee, Dong-Eun;Kim, Sook-Han;Lee, Eung-Ki
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.1
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    • pp.1-6
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    • 2007
  • In order to raise productivity of the OLED and realization of the OLED TV, the enlargement of the mother glass substrate is required. The large-size glass substrate has some difficulties regarding its deflection during handling operation due to its thin thickness (0.5$\sim$0.7t) which is not even enough to stand its mass itself. This paper is demonstrating a new solution of this difficult through clamping and bending boundary condition, which helps to minimize the deflection of the glass substrate. Based on the developed method, the experiments had been done for verifying the proposed method to minimize the glass-deflection. With the developed method, the new design of glass substrate handler can be proposed to allow the large OLED displays be manufactured.

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Study on a large-size glass substrate handler for new generation OLED (차세대 유기 EL 디스플레이를 위한 기판 조작에 관한 연구)

  • Kim Soak-Han;Lee Dong-Eun;Kim Jun-Chul;Lee Eung-Ki
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.79-80
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    • 2006
  • In order to raise productivity of the OLED and realization of the OLED TV, it is required to improve the design of the board size glass panel. The large-size glass substrate has some difficulties regarding its deflection during handling operation due to its small thickness (0.7t) which is not even enough to stand its mass itself. This paper is demonstrating a new solution of this difficult through clamping and bending end condition, which helps to minimize the deflection of the glass substrate.

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Development of Measurement System for Deflection of the Large-Size FPD (대면적 평판 디스플레이용 유리기판의 처짐 측정장치 개발)

  • Kim, Sook-Han;Kim, Tae-Sik;Lee, Eung-Ki
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.4
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    • pp.1-5
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    • 2008
  • There is a need to enlarge the mother glass substrate in OLED to raise its productivity and to realize OLED TV. On the other hand, some difficulties may arise regarding the deflection of a large glass substrate during its handling operation due to its thinness $(0.5\sim0.7t)$, which is not even enough to allow it to stand its own mass. This thesis proposes a conceptual plan for the application of the clamping- and bending-end conditions to the glass substrate handler. To verify proposed plan, the non-contact 3 dimensional measuring instrument is developed. The composition of the 3 dimensional measuring instrument measures shape of the product using X-Y stage robot and laser distance sensor. X-Y stage robot and laser distance sensor are controlled by LabVIEW language. To calibrate measuring instrument, the direction conversion of the Euler angle was used. In order to confirm deflection of the glass substrate, the experiment was carried out at the bending end boundary condition and the proposed effect was verified.

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