Proceedings of the Korean Society Of Semiconductor Equipment Technology (한국반도체및디스플레이장비학회:학술대회논문집)
- 2002.11a
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- Pages.120-122
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- 2002
Multilayer diffusion barrier scheme using a thin metal interlayer(M=Al, Ru, Cr, and Zr) between TiN films for Cu metallization
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Kim, Ki-Bum
(School of Materials Science & Engineering, Seoul National University)
;
- Kim, Soo-Hyun (School of Materials Science & Engineering, Seoul National University) ;
- Nam, Ki-Tae (Materials Science and Engineering, MIT) ;
- Arindom Datta (Department of Physics, Texias Tech. University) ;
- Kang, Dae-Hwan (Research Insittute of Advanced Materials) ;
- Kim, Kim, Hyun-Mi (School of Materials Science & Engineering, Seoul National University)
- Published : 2002.11.01
Abstract
Keywords