Analysis of Non-uniform Tension Effect on Dynamic Characteristics of Spinning Circular Plates in the Wafer Cutting Machine

웨이퍼 가공기에서 회전 원판의 동특성에 미치는 불균일 장력의 영향 분석

  • 임경화 (한국기술교육대학교 제어기계공학과)
  • Published : 1998.04.01

Abstract

The forced vibration analysis of the outer-clamped spinnig annular disk with arbitrary in-plane is formulated to investigate the influence of non-uniform tension on the cutting accuracy of wafer cutting machine. The arbitrary in-plan force along the outer edge of an annular plate is expressed as a Fourier series. Galerkin method and modal superposition method are employed to obtain the forced responses under the static force and the impulse force in astationary coordinate. Through qualitative and quantitative analyses, it can be found that forced and impulse responses are sensitive to the non-uniformity of in-plane force, which can bring a bad effect to the accuracy of wafer cutting process. Also, in case of a spinning disk with non-uniform in-plane force, critical speed is required to define in a different way, compared with conventional definition in axi-symmetrical spinning disk.

Keywords

References

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