DOI QR코드

DOI QR Code

Tripod polishing을 이용한 IBAD/RABiTS 기판의 TEM 분석

TEM analysis of IBAD/RABiTS substrates prepared by Tripod polishing

  • 최순미 (경상대대학원 세라믹공학과) ;
  • 정준기 (창원대 산업기술연구원) ;
  • 유상임 (서울대 공대 재료공학부) ;
  • 박찬 (서울대 공대 재료공학부) ;
  • 오상수 (한국전기연구원) ;
  • 김철진 (경상대 공대 세라믹공학과)
  • 발행 : 2006.03.01

초록

Sample preparation plays a critical role in microstructure analysis using TEM. Although TEM specimen has been usually prepared by jet-polishing or Ar-ion beam milling technique. these methods could not be applied to YBCO CC which is composed of IBAD or RABiTS substrates, several buffet layers, and YBCO superconducting layer because of big difference in mechanical strengths between the metallic phase and oxide phases. To obtain useful cross-sectional information such as interface between the phases or second phases in YBCO CC, it is prerequisite to secure the large area of thin section in the cross-sectional direction. The superconducting layer or the buffer layers are relatively weak and fragile compared to the metallic substrate such as Ni-5wt%W RABiTS of Hastelloy-based IBAD, and preferential removal of weak ceramic phases during polishing steps makes specimen preparation almost impossible. Tripod polisher and small jig were home-made and employed to sample preparation. The polishing angle was maintained <$1^{\circ}$ throughout the polishing steps using 2 micrometers attached to the tripod plate. TEM specimens with large and thin area could be secured and used for RABiTS/IBAD substrate analyses. In some cases, additional Ar-beam ion milling with low beam current and impinging angle was used for less than 30 sec. to remove debris or polishing media attacked to the specimens.

키워드

참고문헌

  1. P.N.Arendt. S.R.Foltyn. L.Civale. R.F. Depaula. P.C.Dowden. J.R.Groves. T.G. Holesinger. Q.X.Jia. S.Kreiskott. L.Stan. I.Usov, H.Wang. J.Y.Coulter. "High critical current YBCO coated conductors based on IBAD MgO". Physica C. 412-414. 795-800. 2004 https://doi.org/10.1016/j.physc.2003.12.074
  2. A.Goyal. D.F.Lee. F.A.List. E.D.Specht. R.Feenstra. M.Paranthaman. X.Cui. S.W.Lu, P.M.Martin. D.M.Kroeger. D.K.Christen. B.W.Kang. D.P.Norton. C.Park. D.T.Verebelyi. J.R.Thompson. R.K.Williams. T.Aytug. C.Cantoni. "Recent progress in the fabrication of high-Jc tapes by epitaxial deposition of YBCO on RABiTS". Physica C. 357-360. 903-913. 2001
  3. Bravman JC. Schinclair R "Mechenical polishing to submicron thickness for extensive thin area in heterogeneous samples". J Electron Microscopy Technology 1. 53-57. 1984
  4. T.Kato. T.Araki. T.Yuasa. Y.Iijima. T.Saitoh. T.Hirayama. Y.Yamada. I.Hirabayashi. "Microstructure of TFA-MOD superconductor filim on metal tape". Physica C. 378-381. 1028-1032. 2002 https://doi.org/10.1016/S0921-4534(02)01571-X
  5. J.P.Benedict. S.J.Klepeis. W.G.Vandygrift. R.Anderson. ''A Methode for precision specimen preparation for both SEM and TEM analysis". EMSA bulletin 19.2. 74-79. 1989
  6. D.D.Dawson-Elli. M.A.Turowski. T.F.Kelly. Y.W.Kim. N.A.Zreiba. Z.Mei. "Specimen preparation for transmission electron microscopy of materials". Mat Res Soc Symposium Proceedings 199. 75-84. 1990
  7. Hao Li. L. Salamanca-Riba. "The concept of high angle wedge polishing and thickness monitoring in TEM sample preparation". Ultramicroscopy. 88. 171-178. 2001 https://doi.org/10.1016/S0304-3991(01)00079-1
  8. J. Chen. D.G.Ivey. "Preparation of metallized GaN/sapphire cross sections for TEM analysis using wedge polishing". Micron. 33, 489-492. 2002 https://doi.org/10.1016/S0968-4328(01)00038-5
  9. P.M. Voyles, J.L. Grazul. D.A. Muller. "Imaging individual atoms inside crystals with ADF-STEM", Ultramicroscopy 96. 251-273. 2003 https://doi.org/10.1016/S0304-3991(03)00092-5