대기압 플라즈마 설비 개발 및 Flip Chip BGA 제조공정 적용

Development of Atmospheric Pressure Plasma Equipment and It's Application to Flip Chip BGA Manufacturing Process

  • 이기석 (국립공주대학교 기계자동차공학부) ;
  • 유선중 (삼성전기 기판사업부)
  • Lee, Ki-Seok (Division of Mechanical Automotive Engineering, KONGJU National University) ;
  • Ryu, Sun-Joong (ACI Division, Samsung Electro-Mechanics)
  • 발행 : 2009.06.30

초록

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

키워드

참고문헌

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