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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Design for a Dual-Frequency Antenna-in-Package

  • Li, Li (College of Physics and Electronics Engineering, Shanxi University) ;
  • Han, Liping (College of Physics and Electronics Engineering, Shanxi University) ;
  • Han, Guorui (College of Physics and Electronics Engineering, Shanxi University) ;
  • Chen, Xinwei (College of Physics and Electronics Engineering, Shanxi University) ;
  • Geng, Yanfeng (College of Physics and Electronics Engineering, Shanxi University) ;
  • Zhang, Wenmei (College of Physics and Electronics Engineering, Shanxi University)
  • Received : 2010.02.09
  • Accepted : 2010.05.06
  • Published : 2010.08.30
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Abstract

For an antenna-in-package (AiP), via holes are used to connect the antenna ground and system ground. In this letter, a dual-frequency AiP with a U-slot embedded in the patch is proposed. By properly arranging three via holes under the non-radiating edge, an AiP with two resonant frequencies is realized. Then a U-slot is embedded in the patch to further improve the bandwidth of the AiP. To validate the proposed design, an AiP with the bandwidth of 4.49% at 2.45 GHz and 6.02% at 5.32 GHz is achieved and fabricated. The measured results agree with the simulated results.

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References

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  1. Antenna in LTCC Technologies: A Review and the Current State of the Art vol.57, pp.2, 2010, https://doi.org/10.1109/map.2015.2414668