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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Highly Miniaturized On-Chip $180^{\circ}$ Hybrid Employing Periodic Ground Strip Structure for Application to Silicon RFIC

  • Yun, Young (Department of Radio Communication Engineering, Korea Maritime University)
  • Received : 2010.03.15
  • Accepted : 2010.07.26
  • Published : 2011.02.28
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Abstract

A highly miniaturized on-chip $180^{\circ}$ hybrid employing periodic ground strip structure (PGSS) was realized on a silicon radio frequency integrated circuit. The PGSS was placed at the interface between $SiO_2$ film and silicon substrate, and it was electrically connected to top-side ground planes through the contacts. Owing to the short wavelength characteristic of the transmission line employing the PGSS, the on-chip $180^{\circ}$ hybrid was highly miniaturized. Concretely, the on-chip $180^{\circ}$ hybrid exhibited good radio frequency performances from 37 GHz to 55 GHz, and it was 0.325 $mm^2$, which is 19.3% of a conventional $180^{\circ}$ hybrid. The miniaturization technique proposed in this work can be also used in other fields including compound semiconducting devices, such as high electron mobility transistors, diamond field effect transistors, and light emitting diodes.

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References

  1. D.M. Pozar, Microwave Engineering, Reading, MA: Addison- Wesley, 1990.
  2. M. Chongcheawchamnam, N. Siripon, and I.D. Robertson, "Design and Performance of Improved Lumped-Distributed Wilkinson Divider Topology," Electron. Lett., vol. 37, no. 8, Apr. 2001, pp. 501-503. https://doi.org/10.1049/el:20010356
  3. D.R. Webster, G. Ataei, and D.G. Haigh, "Low-Distortion MMIC Power Amplifier Using a New Form of Derivative Superposition," IEEE Trans. Microw. Theory Tech., vol. 49, no. 2, Feb. 2001, pp. 328-332. https://doi.org/10.1109/22.903093
  4. Y. Yun et al., "A High Performance Downconverter MMIC for DBS Applications," IEICE Trans. Electron., vol. E84-C, no. 11, Nov. 2001, pp. 1679-1688.
  5. M. Zargari and D. Su, "Challenges in Designing CMOS Wireless Systems-on-a-Chip," IEICE Trans. Electron., vol. E90-C, no. 6, Jun. 2007, pp. 1142-1148. https://doi.org/10.1093/ietele/e90-c.6.1142
  6. Y. Yun et al., "Experimental Study on Isolation Characteristics Between Adjacent Microstrip Lines Employing Periodically Perforated Ground Metal for Application to Highly Integrated GaAs MMICs," IEEE Microw. Wireless Compon. Lett., vol. 17, no. 10, Oct. 2007, pp. 703-705. https://doi.org/10.1109/LMWC.2007.905597
  7. S. Seki and H. Hasegawa, "Cross-Tie Slow-Wave coplanar Waveguide on Semi-Insulating GaAs Substrate," Electron. Lett., vol. 17, no. 25, Dec. 1981, pp. 940-941. https://doi.org/10.1049/el:19810657
  8. T.S.D. Cheung and J.R. Long, "Shielded Passive Devices for Silicon-Based Monolithic Microwave and Millimeter-Wave Integrated Circuits," IEEE J. Solid-State Circuits, vol. 41, no. 5, May 2006, pp. 1183-1200. https://doi.org/10.1109/JSSC.2006.872737
  9. Y. Yun et al., "Miniaturized On-Chip Branch-line Coupler Employing Periodically Arrayed Grounded-Strip Structure for Application to Silicon RFIC," Microw. J, vol. 52, no. 12, 2009, pp. 90-98.
  10. P.J. van Wijnen, H.R. Claessen, and E.A. Wolsheimer, "A New Straighforward Calbration and Correction Procedure for On Wafer High Frequency S-Parameter Measurements," IEEE BCTM, 1987, pp. 70-73.

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