Journal of ILASS-Korea (한국분무공학회지)

Institute for Liquid Atomization and Spray Systems-Korea (한국분무공학회)
권호 표지
DOI QR코드

DOI QR Code

A Study of Substrate Surface Treatment and Metal Pattern Formation using Inkjet Printing Technology

잉크젯 프린팅 기술을 이용한 기판 표면처리와 금속 패턴 형성에 관한 연구

  • 조용민 (한국교통대학교 기계공학과 대학원) ;
  • 박성준 (한국교통대학교 기계공학과)
  • Received : 2012.02.03
  • Accepted : 2012.03.26
  • Published : 2012.03.30
Download PDF
⟨ Previous Next ⟩

Abstract

Inkjet printing is one of the direct writing technologies and is able to form a pattern onto substrate by dispensing droplets in desired position. Also, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. To form a metal pattern, it must be harmonized with conductive nano ink, printing process, sintering, and surface treatment. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense $20-40{\mu}m$ diameter droplets and silver nano ink which consists of 50 nm silver particles. In addition, hydrophobic treatment of surface, overlap printing techniques, and sintering conditions with changing temperature and times to achieve higher conductivity.

Keywords

References

  1. 고재범, 강찬희, 박홍철, 이호민, 손희주, 주병권, "차세대 디스플레이 FED의 기술현황 및 전망", 월간전자부품, 2005, pp. 90-100.
  2. 백만인, 홍순국, 최영준, 이달원, 유상전, 강동우, 양기섭, "Inkjet Printing 기술 동향과 향후 전망", 인포메이션 디스플레이, 2009, pp. 2-13.
  3. 김기현, 송윤호, "디스플레이용 플라스틱 기판의 전망", 전자통신동향분석 Vol. 23, No. 5, 2008, pp.111-123.
  4. 장성연, "전도성 고분자의 패터닝 기술", 고분자과학과 기술, Vol. 18, No. 2, 2007, pp. 173-179.
  5. S. W. Han, T. W. Lim, J. W. Chung, D. J. Kim and J. H. Moon, "Sintering and Nanosecond Laser Ablation of Silver Nanoparticle Film", The Korea Society of Mechanical Engineers spring autumn symposium, Vol. 2006, No. 6, 2006, pp. 2120-2126.
  6. A. L. Dearden, P. J. Smith, D. Y. Shin, N. Reis, B. Derby and P. Brien, "A Low Curing Temperature Silver Ink for Use in Ink-jet Printing and Subsequent Production of Conductive Tracks", Micromol. Rapid Commun, Vol. 26, 2005, pp. 315-318. https://doi.org/10.1002/marc.200400445