Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Improvement of Temperature Characteristics in Ceramic-packaged Shunt Resistors

세라믹 패키지를 이용한 shunt 저항의 온도 특성 개선

  • Kang, Doo-Won (Department of Electrical and Computer Engineering, Ajou University) ;
  • Jo, Jungyol (Department of Electrical and Computer Engineering, Ajou University)
  • 강두원 (아주대학교 전자공학과) ;
  • 조중열 (아주대학교 전자공학과)
  • Received : 2015.09.01
  • Accepted : 2015.09.22
  • Published : 2015.09.30
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Abstract

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

Keywords

References

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