Applied Microscopy

  • 제45권2호
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  • Pages.89-94
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  • 2015
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  • 2287-5123(pISSN)
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  • 2287-4445(eISSN)
한국현미경학회 (Korean Society of Microscopy)
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Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

  • Bae, Jee-Hwan (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Shin, Keesam (School of Nano and Advanced Materials Engineering, Changwon National University) ;
  • Lee, Joon-Hwan (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) ;
  • Kim, Mi-Yang (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) ;
  • Yang, Cheol-Woong (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • 투고 : 2015.06.22
  • 심사 : 2015.06.26
  • 발행 : 2015.06.30
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초록

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

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참고문헌

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피인용 문헌

  1. Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates vol.46, pp.4, 2017, https://doi.org/10.1007/s11664-016-5272-0