반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

반도체 Wafer용 Edge Grinding Machine의 구조 안정화를 위한 설계 개선

Design Alterations of a Semiconductor Wafer Edge Grinder for the Improved Stability

  • 박유라 (금오공과대학교 대학원) ;
  • 노승훈 (금오공과대학교 기계시스템공학과) ;
  • 김영조 (금오공과대학교 대학원) ;
  • 길사근 (금오공과대학교 대학원) ;
  • 김건형 (금오공과대학교 대학원) ;
  • 신윤호 (금오공과대학교 대학원)
  • Park, Yu Ra (Graduate School, Kumoh National Institute of Technology) ;
  • Ro, Seung Hoon (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology) ;
  • Kim, Young Jo (Graduate School, Kumoh National Institute of Technology) ;
  • Kil, Sa Geun (Graduate School, Kumoh National Institute of Technology) ;
  • Kim, Geon Hyeong (Graduate School, Kumoh National Institute of Technology) ;
  • Shin, Yun Ho (Graduate School, Kumoh National Institute of Technology)
  • 투고 : 2016.03.07
  • 심사 : 2016.03.23
  • 발행 : 2016.03.31
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초록

It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.

키워드

참고문헌

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