Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Study on Coolant Passage for Improving Temperature Uniformity of the Electrostatic Chuck Surface

정전척 표면의 온도 균일도 향상을 위한 냉매 유로 형상에 관한 연구

  • Kim, Dae-Hyeon (Department of Mechatronics Engineering, Korea University of Technology and Education) ;
  • Kim, Kwang-Sun (Department of Mechatronics Engineering, Korea University of Technology and Education)
  • 김대현 (한국기술교육대학교 대학원 메카트로닉스 공학부) ;
  • 김광선 (한국기술교육대학교 메카트로닉스 공학부)
  • Received : 2016.09.11
  • Accepted : 2016.09.23
  • Published : 2016.09.30
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Abstract

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

Keywords

References

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