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Effect of Metal Barrier Layer for Flexible Solar Cell Devices on Tainless Steel Substrates

  • Kim, Kyoung-Bo (Department of Metallurgical & Materials Engineering, Inha Technical College)
  • Received : 2016.11.23
  • Accepted : 2016.12.16
  • Published : 2017.01.31

Abstract

A thin metal layer of molybdenum is placed between the conventional barrier layer and the stainless steel substrate for investigating the diffusion property of iron (Fe) atoms. In this study, the protection probability was confirmed by measuring the concentration of out-diffused Fe using a SIMS depth profile. The Fe concentration of chromium (Cr) barrier layer with 10 nm molybdenum (Mo) layer is 5 times lower than that of Cr barrier without the thin Mo layer. The insertion of a thin Mo metal layer between the barrier layer and the stainless steel substrate effectively protects the out-diffusion of Fe atoms.

Keywords

References

  1. Blosch, D. Guttler, A. Chirila, and A.N. Tiwari, Thin Solid Films 519, 7453 (2011). https://doi.org/10.1016/j.tsf.2010.12.187
  2. J. Perrenoud, B. Schaffner, S. Buecheler and A. N. Tiwari, Solar Energy Materials & Solar Cells 95, S8 (2011). https://doi.org/10.1016/j.solmat.2010.11.019
  3. J. Moon, D. -J. Park, C. H. Chung, Y. -H. Kim, S. J. Yun, J.W. Lim, J.-H. Lee, Mater. Res. Soc. Symp. Proc. 910, 0910-A18-03 (2006).
  4. Otte, L. Makhova, A. Braun, and I. Konovalov, Thin Solid Films 511-512, 613 (2006). https://doi.org/10.1016/j.tsf.2005.11.068
  5. F. Kessler, D. Herrmann, and M. Powalla, Thin Solid Films 480, 491 (2005).
  6. B. B. Van Aken, C. Devilee, M. Dorenkamper, M. Geusebroek, M.C.R. Heijna, J. Loffler, and W. J. Soppe, Journal of Non-Crystalline Solids 354, 2392 (2008). https://doi.org/10.1016/j.jnoncrysol.2007.09.024
  7. K. Herz, A. Eicke, F. Kessler, R. W achter, and M. Powalla, Thin Solid Films 431-432, 392 (2003) https://doi.org/10.1016/S0040-6090(03)00259-1
  8. R. Wuerz, A. Eicke, M. Frankenfeld, F. Kessler, M. Powalla, P. Rogin, and O. Yazdani-Assl, Thin Solid Films 517, 2415 (2009). https://doi.org/10.1016/j.tsf.2008.11.016
  9. F. Kessler, K. Herz, M. Powalla, M. Hartmann, M. Schmidt, A. Jasanek, and H. W. Schock, Proceeding Vol. 668 of the Mat. Res. Soc. Symp., San Francisco, 2001, p. H3.6.1.
  10. K. Herz, F. Kessler, R. Wächter, M. Powalla, J. Schneider, A. Schulz, and U. Schumacher, Thin Solid Films 403-404, 384 (2002). https://doi.org/10.1016/S0040-6090(01)01516-4
  11. M. Hartmann, M. Schmidt, A. Jasenek, H.-W. Schock, F. Kessler, K. Herz, and M. Powalla, Proceedings of the 28th IEEE Phot. Spec. Conf., Anchorage, 2000, p. 638.
  12. G. S. Vicente, J. Herrero, A. Morales, C. Mafiotte, M. T. Gutierrez, M. Hartmann, A. Jasenek, and H. W. Schock, Proceedings of the 17th Eur. Phot. Sol. Conf., Munich, 2001, p. 1098.
  13. D. Amouzou, J. Dumont, L. Fourdrinier, J. Richir, F. Maseri, and R. Sporken, Thin Solid Films 531, 535 (2013). https://doi.org/10.1016/j.tsf.2013.01.069