Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Preparation and Characterization of Chemically Modified Wood Flour Reinforced Phenol-formaldehyde Composites

  • Nam, Byeong-Uk (School of Energy, Material & Chemical Engineering, Korea University of Technology and Education) ;
  • Mun, Jun-Yeong (School of Energy, Material & Chemical Engineering, Korea University of Technology and Education)
  • Received : 2018.02.02
  • Accepted : 2018.03.21
  • Published : 2018.03.31
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Abstract

Wood Polymer Composites(WPC) have attracted significant attention because of ecological and environmental concerns. However, the structure of Wood Flour containing many hydroxyl groups(-OH) reduces the interface adhesion to Phenol-formaldehyde(PF) and it decreases the mechanical properties of the PF/Wood Flour Composites. The present work involves the modification of Wood Flour using silanes reinforced with Phenol-formaldehyde to enhance the mechanical properties of the composites. The spectroscopic properties of the composites were analyzed using FT-IR, XPS(X-ray Photoelectron Spectroscopy) and the mechanical properties i.e., tensile strength, flexural strength and impact strength were studied. We confirmed the modification effect of silanes by spectroscopic analysis, and the mechanical properties of the composites using wood flour modified by silanes were significantly improved.

Keywords

References

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