Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Evaluation of the Machining Method on the Formation of Surface Quality of Upper Electrode for Semiconductor Plasma Etch Process

반도체 플라즈마 에칭 상부 전극의 표면 품질 형성에 관한 가공법 평가

  • Lee, Eun Young (Department of Mechatronics Engineering, Graduate School of Korea University of Technology and Education) ;
  • Kim, Moon Ki (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 이은영 (한국기술교육대학교 메카트로닉스공학과) ;
  • 김문기 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2019.10.25
  • Accepted : 2019.12.12
  • Published : 2019.12.31
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Abstract

This study has been focused on properties of surface technology for large diameter upper electrode using in high density plasma process as like semi-conductor manufacturing process. The experimental studies have been carried out to get mirror surface for upper electrode. For a formation of high surface quality upper electrode, single crystal silicon upper electrode has been mechanical and chemical machining worked. Mechanical machining work of the upper electrode is carried out with varying mesh type using diamond wheel. In case of chemical machining work, upper electrode surface roughness was observed to be strongly dependent upon the etchant. The different surface roughness characteristics were observed according to etchant. The machining result of the surface roughness and surface morphology have been analyzed by use of surface roughness tester, laser microscope and ICP-MS.

Keywords

References

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