Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on Tensile Strength of the Product According to Humidity During 3D Printing Process

3D프린팅 공정 중 공기 습도에 따른 출력물의 인장 강도에 관한 연구

  • Lee, Song Yeon (Mechatronics Engineering, Graduate School of Korea University of Technology and Education) ;
  • Huh, Yong Jeong (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 이송연 (한국기술교육대학교 대학원 메카트로닉스공학과) ;
  • 허용정 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2021.12.09
  • Accepted : 2021.12.16
  • Published : 2021.12.31
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Abstract

Scaffolds protect the sensor in the body. Scaffolds are made of a bioabsorbable polymer. The polymer process is sensitive to humidity. Inside of the 3D printer has been improved to control the humidity. Specimens were produced by injection molding and 3D printer. 3D printed specimens were printed under various humidity conditions. We measured tensile strength of the injection-molded specimen and tensile strength of the 3d printing specimen. We compared tensile strength of the injection-molded specimen and tensile strength of the 3d printing specimen. Tensile strength of the injection-molded specimen is 557 kgf/cm2. We confirmed tensile strength of the specimen was highest at 741 kgf/cm2 when the humidity was 10 %. We confirmed lower the humidity, higher tensile strength of the polymer product.

Keywords

Acknowledgement

이 논문은 20 21년도 한국기술교육대학교 교수 교육연구진흥과제 지원에 의하여 연구되었음.

References

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