Topology Optimization of Reinforcement Pattern for Pressure-Explosion Proof Enclosure Door in Semiconductor Manufacturing Process

위상최적화 기법을 이용한 반도체 공정용 압력방폭형 외함 도어의 보강 패턴 최적화

  • Yeong Sang Kim (Mechatronics Engineering of Kongju National University, Hwasin Co., Ltd) ;
  • Dong Seok Shin (Industrial Technology Research Institute of Kongju National University) ;
  • Euy Sik Jeon (Future Convergence Engineering of Kongju National University, Industrial Technology Research Institute of Kongju National University)
  • 김영상 (공주대학교 기전공학과, (주)화신) ;
  • 신동석 (공주대학교 생산기술연구소) ;
  • 전의식 (공주대학교 미래융합공학과, 공주대학교 생산기술연구소)
  • Received : 2023.06.01
  • Accepted : 2023.06.21
  • Published : 2023.06.30

Abstract

This paper presents a method using finite element analysis and topology optimization to address the issue of overdesign in pressure-explosion proof enclosure doors for semiconductor manufacturing processes. The design conducted in this paper focuses on the pattern design of the enclosure door and its fixation components. The process consists of a solid-filled model, a topology optimization model, and a post-processing model. By applying environmental conditions to each model and comparing the maximum displacement, maximum equivalent stress, and weight values, it was confirmed that a reduction of about 13% in weight is achievable.

Keywords

References

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