열 공압 방식을 이용한 다이 이젝터의 개발

Development of a Die Ejector Using Thermopneumatic System

  • 투고 : 2023.06.16
  • 심사 : 2023.09.07
  • 발행 : 2023.09.30

초록

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

키워드

과제정보

본 연구는 정부 산업통상자원부의 '차세대 지능형 반도체 기술 개발(설계, 제조)-반도체 제조공정장비 사업'의 지원을 받아 수행된 연구 결과입니다[과제명: 고직접 반도체 검사용 마이크로 반도체 소켓, 과제번호: 20023152].

참고문헌

  1. W. J. Jang, Y. J. Jeong and H. J. Lee, "Development of Flexure Applied Bond head for Die to Wafer Hybrid Bonding" J. of The Semiconductor & Display Technology, Vol. 20, pp. 171-176, 2021.
  2. S. Behler, Wang Teng, A. Podpod, "Key Properties for Successful Ultra Thin Die Pickup" 67th Electronic Components and Technology Conference (ECTC), pp. 2017.
  3. J. H. Lee, J. Y. Song, T. H. Ha, C. W. Lee and H. J. Kim "Study on Ultra-Thin Chip Ejecting Technology using Multi-Steps Method for Multi-Chip Package" Korea Society for Precision Engineering Conference, pp. 71-72, 2012.
  4. Stefan B., "Dynamic Simulation of Die Pickup from Wafer Tape by a Multi-Disc Ejector using Peel-Energy to Peel-Velocity coupling" 17th Electronics Packaging and Technology Conference (EPTC), 2015.
  5. Zunxu Liu, Yong An Huang, Huimin Liu, Jiankui Chen and Zhouping Yin "Reliable Peeling of Ultrathin Die With Multineedle Ejector" Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, pp. 1545-1554, 2014. https://doi.org/10.1109/TCPMT.2014.2344106
  6. Masaya Kawano, Naoya Hirota, Sharon Pei-Siang Lim, and Ser-Choong Chong " Ultrathin Die Pick-Up for 3D Chip Stacking" 21st Electronics Packaging Technology Conference, pp 171-174, 2019.
  7. Stefan B., " How To Peel Ultra Thin Dies From Wafer Tape" Electronics Packaging Society, SCV Chapter, 2017.
  8. Ahmad R. A. Rahman., Nazrul Anuar Nayan., "Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die," iJOE - Vol.16, No.8, 55-67.
  9. Xu Zhoulong., Yongan Huang., Zunxu Liu., "Vacuum-based Picking-up of Thin Chip from Adhesive Tape" Journal of Adhesion Science and Technology, Vol. 29, pp. 1315-1329, 2015. https://doi.org/10.1080/01694243.2015.1026869
  10. T. H. Cheng, C. C. Du and C. H. Tseng, "Study in IC Chip Failure During Pick-up Process by Using Experimental and Finite Element Methods" Journal of Materials Processing Technology, Vol. 172, pp. 407-416, 2006. https://doi.org/10.1016/j.jmatprotec.2005.11.002
  11. Richard Qian., Yong Liu., "Thin and Large Die Assembly Pick Up Process Optimization by Dynamic Modeling", 2016 17th International Conference on Electronic Packaging Technology, 147-152.
  12. Zhilong Peng., Cong Wang., Lei Chen., Shaohua Chen., "Peeling Behavior of a Viscoelastic Thin-Film on a Rigid Substrate", International Journal of Solids and Structures 51, 25-26.
  13. E. B Jeon, S. H. Park, Y. S. Yoo, H. S. Kim, "Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method". IEEE Transactions On Components, Packaging And Manufactruing Technology, Vol. 06, No. 11, 1696-1702.