반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Settling Time에 따른 웨이퍼 TTV 측정 및 변수 영향 분석

Wafer TTV Measurement and Variable Effect Analysis According to Settling Time

  • Hyeong Won Kim (Korea Institute of Industrial Technology) ;
  • Anmok Jeong (Korea Institute of Industrial Technology) ;
  • Taeho Kim (Korea Institute of Industrial Technology) ;
  • Hak Jun Lee (Korea Institute of Industrial Technology)
  • 투고 : 2023.06.20
  • 심사 : 2023.09.07
  • 발행 : 2023.09.30
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초록

High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

키워드

과제정보

본 연구는 정부 산업통상자원부의 'PIM인공지능반도체 핵심기술개발 사업'의 지원을 받아 수행된 연구 결과입니다[과제명: HBM 제조를 위한 초박형 웨이퍼 핸들링용 본딩 장비 개발/과제 고유번호: RS-2022-00154701].

참고문헌

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  3. Jun, Hongshin, et al. "High-bandwidth memory (HBM) test challenges and solutions." IEEE Design & Test 34.1 (2016): 16-25.
  4. Korea Institute of Machinery and Materials. "Development of core technology for ultra-thin wafer TBDB (Temporary Bonding De-Bonding) equipment". Ministry of Science, ICT and Future Planning, 2014.
  5. KEYENCE." Eddy Current Displacement Sensor among Precision Measurement Libraries" [https://www.keyence.co.kr/ss/products/measure/library/type/inductive.jsp] (2023).
  6. Yong-Tae Jeon, Hyun Lee, and Jae Sung Choi. "Development of 3D surface shape analysis system using white light scanning interference." Korean Information Processing Society Conference Proceedings 24.1 (2017): 625-628.5.
  7. Hyun-Woo Oh, and Woong-Sik Kim. "The Development of Bumped Wafer Inspection System Using Confocal Principle." Journal of the Institute of Electronic and Information Engineering 56.7 (2019): 47-54. https://doi.org/10.5573/ieie.2019.56.7.47