Measurement of Condensation and Boiling Heat Transfer Coefficients of Non-flammable Mixed Refrigerant for Design of Cryogenic Cooling System for Semiconductor Etching Process

반도체 식각 공정용 초저온 냉각 시스템 설계를 위한 비가연성 혼합냉매 응축 및 비등 열전달 계수 측정

  • Cheonkyu Lee (Carbon Neutral Technology R&D Department, Research Institute of Clean Manufacturing System, Korea Institute of Industrial Technology (KITECH)) ;
  • Jung-Gil Lee (Carbon Neutral Technology R&D Department, Research Institute of Clean Manufacturing System, Korea Institute of Industrial Technology (KITECH))
  • 이천규 (한국생산기술연구원 청정기술연구소 탄소중립산업기술연구부문) ;
  • 이정길 (한국생산기술연구원 청정기술연구소 탄소중립산업기술연구부문)
  • Received : 2023.09.08
  • Accepted : 2023.09.18
  • Published : 2023.09.30

Abstract

In this study, experimental approach of the measurement of condensation and evaporation heat transfer coefficients is discussed for mixed refrigerants using in the ultra low-temperature cooling system for semiconductor etching process. An experimental apparatus was described performing the condensation and evaporation heat transfer measurements for mixed refrigerants. The mixed refrigerant used in this study was composed of the optimal mixture determined in previous research, with a composition of Ar:R14:R23:R218 = 0.15:0.4:0.15:0.3. The experiments were conducted over a temperature range from -82℃ to 15℃ and at pressures ranging from 18.5 bar to 5 bar. The convection heat transfer coefficients of the mixed refrigerant were measured at flow rates corresponding to actual operating conditions. The condensation heat transfer coefficient ranged from approximately 0.7 to 0.9 kW/m2K, while the evaporation heat transfer coefficient ranged from 1.0 to 1.7 kW/m2K. The detailed discussion of the experimental methods, procedures, and results were described in this paper.

Keywords

Acknowledgement

본 연구는 2021년도 산업통상자원부 기계·장비산업기술개발사업"냉각용량 2 kW급 반도체 식각 공정(Etching Process)용 초저온 냉각 시스템 개발"의 연구비 지원에 의한 연구임 (No. 20014817)

References

  1. Nojiri, K., 2015, Dry Etching Technology for Semiconductors, Springer, Switzerland, pp. 1~30
  2. Tandou,T., Kubo, S., Yokogawa, K., Negishi, N., Izawa, M., "Improving the etching performance of high-aspectratio contacts by wafer temperature control Uniform temperature design and etching rate enhancement", Precision Engineering, Vol. 44, pp. 87-92, 2016. https://doi.org/10.1016/j.precisioneng.2015.10.006
  3. Dussart, R., Tillocher, T., Lefaucheux, P., Boufnichel, M., "Plasma cryogenic etching of silicon: from the early days to today's advanced technologies", J. Phys. D: Appl. Phys., Vol. 47, pp. 123001, 2014.
  4. Jansen, H., V., de Boer, M. J., Unnikrishnan, S., Louwerse, M. C., Elwenspoek, M. C., "Black silicon method: X. A review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment", J. of Micromech. And Microeng. 19, pp 033001, 2009.
  5. Rezvanov, A., Miakonkikh, A. V., Vishnevskiy, A. S., Rudenko, K. V., Baklanov, M. R., "Cryogenic etching of porous low-k dielectrics in CF3BR and CF4 plasmas", J. Vac. Sci. Technol. B, Vo. 35, pp. 021204, 2017.
  6. Du, H.C. and Hong, S. J., "Temperature Analysis of Electrostatic Chuck for Cryogenic Etch Equipment". Journal of the Semiconductor & Display Technology, Vol. 20, No. 2, pp. 19 - 24, 2021
  7. Lee, C., Kim, J.M. and Lee, J. G., "Design of non-flammable mixed refrigerant Joule-Thomson refrigerator for semiconductor etching process". Journal of the Semiconductor & Display Technology, Vol. 21, No. 2, pp. 144 -149, 2022
  8. Lee C. et al, "Development of non-flammable mixed refrigerant Joule-Thomson refrigerator for semiconductor etching process", 26th International Congress of refrigeration, Paris, France, 2023
  9. Baek S., Lee C., Jeong S., "Investigation of two-phase heat transfer coefficients of argon-freon cryogenic mixed refrigerants", Cryogenics, Vol. 64, pp.29-39, 2014. https://doi.org/10.1016/j.cryogenics.2014.09.004