• Title/Summary/Keyword: Colorless and transparent polyimide film

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Cost-efficient Fabrication of Colorless and Optically Transparent Polyimide Film for Flexible Displays (비용 효율적인 유연 디스플레이용 무색 투명 폴리이미드 필름 제작)

  • Dawoon Jo;Ji-Ho Kim;Chung-Seog Oh
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.1
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    • pp.33-38
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    • 2023
  • As the demand for large flexible displays such as tablet computers continues to rise, there is an increasing need for cost-efficient colorless and optically transparent polyimide film that can meet the desired performance, particularly optical transmittance. In this study, we investigated a detailed procedure for achieving optimal optical transmittance using two different combinations of monomers: 6FDA+BAPB and 6FDA+BPA+TFDB. We employed a design of experiment method to systematically synthesize polymers, allowing for the optimization of optical transmittance. In addition, we were able to achieve uniform thickness in the films by using a doctor blade. By comparing the price and optical transmittance of four different monomer combinations, we obtained fundamental data on the production of polyimide films that can be customized to meet the specific price and performance requirements of manufacturers. This approach enables users to select the most suitable polyimide film based on their desired price and performance parameters while achieving optimal optical transmittance.

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Optimization of Optical Performance of Colorless and Transparent Polyimide Film for Flexible Display using Design of Experiment (실험계획법을 이용한 유연 디스플레이용 무색 투명 폴리이미드 필름의 광학 성능 최적화)

  • Jo, Dawoon;Yu, Yeon-Soo;Nam, Hee-Eun;Chang, Jin-Hae;Oh, Chung-Seog
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.79-84
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    • 2022
  • As various flexible display products are released, the demand for high-performance colorless and transparent polyimide (CPI) film is continuously increasing. The primary purpose of this study is to establish a systematic procedure for optimizing the optical performance of CPI films by applying the response surface method. After selecting three key factors (monomer type, stirring time for varnish synthesis, and maximum temperature of vacuum furnace for film production) affecting optical performance based on experiences and references, CPI films were manufactured according to the experimental sequence designed by the central composite design, and then the yellowness index (YI) and optical transmittance (Tr) of the films were measured. When producing a CPI film by pouring varnish into a petri dish, the change in optical properties according to thickness should be considered, and there was a meaningful linear relationship between YI and Tr. The species of monomer and the maximum temperature were the critical factors that had an influence on YI and Tr, respectively. It is expected that the procedure proposed in this study can serve as a starting point for CPI film optimization studies considering the other factors that were not considered and responses such as thermal properties.

Comparison of Colorless and Transparent Polyimide Films with Various Amine Monomers (다양한 아민 단량체를 이용한 무색 투명 폴리이미드 필름의 특성비교)

  • Kim, Youngmin;Chang, Jin-Hae
    • Applied Chemistry for Engineering
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    • v.23 no.3
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    • pp.266-270
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    • 2012
  • A series of polyimide was prepared by reacting 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) as the anhydride monomer and 2,2'-bis(trifluoromethyl)benzidine (TFB), 2,2'-bis(3-aminophenyl)hexafluoropropane (BAFP), 2,2'-bis(3- amino- 4-methylphenyl) hexafluoropropane (BAMF), bis(3-aminophenyl)sulfone (APS), p-xylyenediamine (p-XDA), or m-xylyenediamine (m-XDA) as the amine monomer in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the poly(amic acid)s (PAAs) solution at various heat treatment temperatures. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) and the mechanical properties were investigated using universal tensile machine (UTM), Their optical transparencies were also investigated using ultraviolet-visible (UV-vis.) spectrophotometry and colorimetry. The yellow index (YI) and coefficient of thermal expansion (CTE) values of all PIs were in the range 0.98~2.76 and 25.73~55.23 $ppm/^{\circ}C$, respectively.

A Study on the Growth Temperature of Atomic Layer Deposition for Photocurrent of ZnO-Based Transparent Flexible Ultraviolet Photodetector (원자층 증착법의 성장온도에 따른 산화아연 기반 투명 유연 자외선 검출기의 광전류에 대한 연구)

  • Choi, Jongyun;Lee, Gun-Woo;Na, Young-Chae;Kim, Jeong-Hyeon;Lee, Jae-Eun;Choi, Ji-Hyeok;Lee, Sung-Nam
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.1
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    • pp.80-85
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    • 2022
  • ZnO-based transparent conductive films have been widely studied to achieve high performance optoelectronic devices such as next generation flexible and transparent display systems. In order to achieve a transparent flexible ZnO-based device, a low temperature growth technique using a flexible polymer substrate is required. In this work, high quality flexible ZnO films were grown on colorless polyimide substrate using atomic layer deposition (ALD). Transparent ZnO films grown from 80 to 200℃ were fabricated with a metal-semiconductor-metal structure photodetectors (PDs). As the growth temperature of ZnO film increases, the photocurrent of UV PDs increases, while the sensitivity of that decreases. In addition, it is found that the response times of the PDs become shorter as the growth temperature increases. Based on these results, we suggest that high-quality ZnO film can be grown below 200℃ in an atomic layer deposition system, and can be applied to transparent and flexible UV PDs with very fast response time and high photocurrent.

Evaluation of Residual Strains under Pure Bending Loading for Colorless and Optically Transparent Polyimide Film for Flexible Display (유연 디스플레이용 무색 투명 폴리이미드 필름의 굽힘 잔류 변형률 평가)

  • Choi, Min-Sung;Park, Min-Seok;Park, Han-Yeong;Oh, Chung-Seog
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.4
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    • pp.49-54
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    • 2021
  • The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.

Synthesis and Characterization of Polyimide Films for Flexible Display Substrates

  • Vu, Quang Hung;Kim, Jin-Woo;Park, Lee-Soon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.633-636
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    • 2008
  • A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

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Residual Stress Behavior and Physical Properties of Colorless and Transparent Polyimide Films (무색 투명 폴리이미드 박막의 잔류응력 거동 및 특성분석)

  • Nam, Ki-Ho;Lee, Wansoo;Seo, Kwangwon;Han, Haksoo
    • Polymer(Korea)
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    • v.38 no.4
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    • pp.510-517
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    • 2014
  • A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.