• Journal of the Semiconductor & Display Technology
• /
• v.9 no.2
• /
• pp.33-39
• /
• 2010

The moisture absorption properties such as diffusion coefficient and moisture content ratio of liquid type epoxy resin systems with the filler were investigated. Bisphenol A type and Bisphenol F type epoxy resin, Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these liquid type epoxy encapsulant according to the change of filler size. The temperature of glass transition (Tg) of these epoxy resin systems was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these epoxy resin systems according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these systems were calculated in terms of modified Crank equation based on Ficks' law. An increase of Tg and diffusion coefficient with filler size in these systems can be observed, which are attributed to the increase of free volume with Tg. The change of maximum moisture absorption ratio according to the filler size and filler content cannot be observed; however, the diffusion coefficients of these systems decreased with filler content. The diffusion via free volume is dominant in the epoxy resin systems with low nano-sized filler content; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the liquid type epoxy encapsulant with high nano-sized filler content.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.11a
• /
• pp.43-46
• /
• 2000

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.134-137
• /
• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

• Applied Chemistry for Engineering
• /
• v.10 no.6
• /
• pp.949-953
• /
• 1999

Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

• Applied Chemistry for Engineering
• /
• v.10 no.8
• /
• pp.1175-1179
• /
• 1999

The rheological properties of highly filled epoxy molding compound(EMC) for semi-conductor encapsulants are greatly affected by the content of filler loaded. In this study, the change of viscosity of EMC for semi-conductor encapsulants with the filler content was investigated. Also, both of Cox-Merz and modified Cox-Merz equations were applied to convert the viscosity change as a function of frequency to that of shear rate. It was ovserved that shear thinning and yield stress occured at high filler contents and that the Cox-Merz equation could not be applied at high filler contents because of the difference of viscosity according to the various strains. When the modified Cox-Merz equation was applied, the all the curves having different strain tend to be represented by one master curve, even though some deviation was obseved at high filler content and strain.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.3
• /
• pp.51-63
• /
• 1999

The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.3
• /
• pp.37-44
• /
• 2000

The corrosion behavior of aluminum pad coated with epoxy molding compound (EMC) was investigated using electrochemical impedance spectroscopy (EIS). The impedance change was evaluated by the absorption of deionized water (DI water) to EMC coating and the interface between EMC and aluminum. During the absorption a decrease in resistance and thus an increase in capacitance of EMC as well as the interface of EMC/Al could be observed. Up to about 170 hours of absorption the EMC was saturated with the water molecules and ions generated from EMC. Subsequently the ionic water was penetrated to the interface and finally the corrosion of aluminum was occurred by the Dl water and ions. From measuring the adhesion strength with the Dl water absorption it was expected that the saturation of water and ions in the interface decreased the adhesion strength. The higher filler content of EMC should be necessary to inhibit the corrosion of aluminum electrode in microelectronic packages.

• Electrical & Electronic Materials
• /
• v.10 no.6
• /
• pp.519-527
• /
• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.