• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.2
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• pp.57-65
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• 1995

The effects of device geometry and layout on high speed performance such as current gain outoff frequency(f$_{T}$) and maximum oscillation frequency(f$_{max}$) are of very improtant for the scaling-down of geterojunction bipolar transistors(HBT$_{s}$). In this paper AlGaAs/GaAs HBTs are fabricated by MBE epitaxial growth and conventional mesa process, and the experimental data of emitter-base geometru dependency of HBT performance are presented in order to provide the quantitative information for optimum device structure design. It is shown that f$_{T}$ and f$_{max}$ are inversely proportional to the emiter stripe width, while the low emitter perimeter/area ratio is better to f$_{T}$ and worse ot f$_{max}$. It is also demonstrated the f$_{T}$ and f$_{max}$ are highly improved by the emitter-base spacing reduction resulting in less parsitic effects. As the result f$_{T}$ of 42GHz and f$_{max}$ of 23GHz are obtained for fabricated HBT with emitter area of 3${\times}20^{\mu}m^{2}$ and E-B spacing of 0.2$\mu$m.m.m.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.392-395
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• 2003

For the first time, the new dual trench gate Emitter Switched Thyristor is proposed for eliminating snap-back effect which leads to a lot of serious problems of device applications. Also, the parasitic thyristor that is inherent in the conventional EST is completely eliminated in the proposed EST structure, allowing higher maximum controllable current densities for ESTs. Moreover, the new dual trench gate allows homogenous current distribution throughout device and preserves the unique feature of the gate controlled current saturation of the thyristor current. The conventional EST exhibits snap-back with the anode voltage and current density 2.73V and $354/{\S}^2$, respectively. But the proposed EST exhibits snap-back with the anode voltage and current density 0.93V and $58A/{\S}^2$, respectively. Saturation current density of the proposed EST at anode voltage 6.11V is $3797A/{\S}^2$. The characteristics of 700V forward blocking of the proposed EST obtained from two dimensional numerical simulations (MEDICI) is described and compared with that of the conventional EST.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.23-26
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• 2011

New organic light-emitting diodes with structure of ITO/DNTPD/TAPC/$Bebq_2/Bebq_2$:RP-411/ET-137/LiF/Al using the selective doping of 5% RP-411 in a single $Bebq_2$ host in the two wavelength(green, red) emitter formation were proposed and characterized. In the experiments, with a 300${\AA}$-thick undoped emitter of $Bebq_2$, three kinds of devices with different thicknesses of 30${\AA}$, 40${\AA}$ and 50${\AA}$ in the doped emitter of $Bebq_2$:RP-411 were fabricated. The electroluminescent spectra showed two peak emissions at the same wavelengths of 511 nm and 622 nm for the fabricated devices. When the device with a 30${\AA}$-thick doped emitter is referred as "D-1", the device with a 40${\AA}$-thick doped emitter is referred as "D-2" and the device with a 50${\AA}$-thick doped emitter is referred as "D-3", the relative intensity of 622 nm to 511 nm at two wavelength peaks was higher in the D-2 and the D-3 than in the D-1. The devices of D-1, D-2 and D-3 showed the color coordinates of (0.43, 0.46), (0.46, 0.44) and (0.48, 0.43) on the CIE chart, respectively.

• The Korean Journal of Ceramics
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• v.2 no.4
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• pp.193-196
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• 1996

A new type of electron emitter device of chemical-vapor-deposited diamond thin film is proposed. The device is a diode of metal-insulator-insulator-semiconductor (MIS) structure consisting of an intrinsic polycrystalline diamond film as the insulator, an aluminium electrode on one side, and hydrogenated diamond surface on the other side as the p-type semconductor with negative electron affinity (NEA). Electrons will be injected and/or excited to the conduction band of intrinsic diamond layer to be emitted from the hydrogenated diamond surface of NEA.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.405-408
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• 1998

Due to the large conduction band discontinuity between emitter base, OmGaAs HBT has an advantge to enable the hot electrons to inject into the base. In this paper, InAlGaAs/InGaAs HBT with the various emitter junction gradings and the modified collectors are simulated and analyzed by HMC(hybrid monte carlo) simulator in order to find a optimal structure for the shortest transit time. A minium base transit time (.tau.$_{b}$ ) of 0.21 ps was obtained for HBT with the grading layer, which is parabolically graded from x=1.0 to x=0.5. The minimum collector transit time (.tau.$_{c}$ ) of 0.31ps was found when the collector was modified by inserting p$^{[-10]}$ and p$^{+}$ layers. Thus HBT in combination with the emitter grading and the modified collector layer showed the cut-off frequency (f$_{T}$) of 183GHz.z.z.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.7
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• pp.171-175
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• 1996

Gate insulator for Si field emitter is usually formed by e-beam evaporation. However, the evaported oxide requires densification for a stable process and a reduction of gate leakage which results from its Si-rich and nonstoicheiometric structure. In this study, we have developed the process technology able to densify the evaporated oxide in H$_{2}$O ambient. Using this process, we have fabricted thefield emitter array with 625 emitters per pixel, of which gate hole diameter is 1.4.mu.m, for the pixel, anode current of 14.3.mu.A was extracted at a gate bias of 100V and gate leakage was about 0.27% of the total emission current.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.65-71
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• 1996

A novel lateral field emitter triode has been designed and fabricated. It has self-vacuum environmets and low turn-on voltage, so that the chief problems of previous field emission devices such as additional vacuum sealing process and high turn-on voltage are settled. An in-situ vaccum encapsulation empolying recessed cavities by isotropic RIE (reactive ion etch) method and an electron beam evaporated molybdenum vacuum seals are implemented to fabricate the new field emitter triode. The device exhibits low turn-on voltage of 7V, stabel current density of 2.mu.A/tip at V$_{AC}$ = 30V, and high transconductance (g$_{m}$) of 1.7$\mu$S at V$_{AC}$ = 22V. The superb device characteristics are probably due to sub-micron dimension device structure and the pencil type lateral cathode tip employing upper and lower LOCOS oxidation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.183-189
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• 2010

In this paper, the trench gate emitter switched thyristor(EST) withl trench gate electrode is proposed for improving snap-back effect which leads to a lot of problems in device applications. The parasitic thyristor which is inherent in the conventional EST is completely eliminated in this structure, allowing higher maximum controllable current densities for ESTs. The dual trench gate allows homogenous current distribution in the EST and preserves the unique feature of the gate controlled current saturation of the thyristor current. The characteristics of the 1700 V forward blocking EST obtained from two-dimensional numerical simulations (MEDICI) is described and compared with that of a conventional EST. we carried out layout, design and process of EST devices.

• Journal of the Korea Society of Computer and Information
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• v.5 no.4
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• pp.102-105
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• 2000

The self-aligned AICaAs/GaAs HBTs with the mesa-etched emitter showed severe degradation in current gain under stress. The cause was identified to be due to instability of the surface states on extrinsic base. In this paper the surface states were diminished by the hetero-passivation of the InGaP ledge emitter and the reliability was drastically improved. The activation energy of current gain degradation was extracted to be 1.97eV and MTTF to be 4.8$\times$108 at 14$0^{\circ}C$ which has satisfied MIL standards.

• Journal of The Korean Society of Agricultural Engineers
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• v.54 no.4
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• pp.29-38
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• 2012

Drip irrigation is a affordable irrigation under structured cultivation. Drip irrigation system with high uniformity can be achieved through effective design, maintenance and management of irrigation systems. Nevertheless the design guidelines have not been established for the drip irrigation system products in domestic and imported considering cultivation method and greenhouse environment in Korea. The objectives of this study were to evaluate the performance of drip irrigation system with uniformity through an experiment. The experiment was conducted to study with nine different types of emitters produced in domestic and imported. Hazen-Williams coefficients were also estimated for the drip emitter through hydraulic simulation for design use. It was found that approximately 91.5 % for 10 cm emitter spacing and 96.2 % for 30 cm emitter spacing of statistical uniformity were observed in respectively. Average emission uniformity was decreased as the reduction of emitter spacing. The results would be used in the drip irrigation system design and guideline construction.