• Title/Summary/Keyword: flip

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Overview on Flip Chip Technology for RF Application (RF 응용을 위한 플립칩 기술)

  • 이영민
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.61-71
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    • 1999
  • The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

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C-FLIP Promotes the Motility of Cancer Cells by Activating FAK and ERK, and Increasing MMP-9 Expression

  • Park, Deokbum;Shim, Eunsook;Kim, Youngmi;Kim, Young Myeong;Lee, Hansoo;Choe, Jongseon;Kang, Dongmin;Lee, Yun-Sil;Jeoung, Dooil
    • Molecules and Cells
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    • v.25 no.2
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    • pp.184-195
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    • 2008
  • We examined the role of c-FLIP in the motility of HeLa cells. A small interfering RNA (siRNA) directed against c-FLIP inhibited the adhesion and motility of the cells without affecting their growth rate. The long form of c-FLIP ($c-FLIP_L$), but not the short form ($c-FLIP_S$), enhanced adhesion and motility. Downregulation of $c-FLIP_L$ with siRNA decreased phosphorylation of FAK and ERK, while overexpression of $c-FLIP_L$ increased their phosphorylation. Overexpression of FAK activated ERK, and enhanced the motility of HeLa cells. FRNK, an inhibitory fragment of FAK, inhibited ERK and decreased motility. Inhibition of ERK also significantly suppressed $c-FLIP_L$-promoted motility. Inhibition of ROCK by Y27632 suppressed the $c-FLIP_L$-promoted motility by reducing phosphorylation of FAK and ERK. Overexpression of $c-FLIP_L$ increased the expression and secretion of MMP-9, and inhibition of MMP-9 by Ilomastat reduced $c-FLIP_L$- promoted cell motility. A caspase-like domain (amino acids 222-376) was found to be necessary for the $c-FLIP_L$-promoted cell motility. We conclude that $c-FLIP_L$ promotes the motility of HeLa cells by activating FAK and ERK, and increasing MMP-9 expression.

Multiple Node Flip Fast-SSC Decoding Algorithm for Polar Codes Based on Node Reliability

  • Rui, Guo;Pei, Yang;Na, Ying;Lixin, Wang
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.16 no.2
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    • pp.658-675
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    • 2022
  • This paper presents a fast-simplified successive cancellation (SC) flipping (Fast-SSC-Flip) decoding algorithm for polar code. Firstly, by researching the probability distribution of the number of error bits in a node caused by channel noise in simplified-SC (SSC) decoder, a measurement criterion of node reliability is proposed. Under the guidance of the criterion, the most unreliable nodes are firstly located, then the unreliable bits are selected for flipping, so as to realize Fast-SSC-Flip decoding algorithm based on node reliability (NR-Fast-SSC-Flip). Secondly, we extended the proposed NR-Fast-SSC-Flip to multiple node (NR-Fast-SSC-Flip-ω) by considering dynamic update to measure node reliability, where ω is the order of flip-nodes set. The extended algorithm can correct the error bits in multiple nodes, and get good performance at medium and high signal-to-noise (SNR) region. Simulation results show that the proposed NR-Fast-SSC-Flip decoder can obtain 0.27dB and 0.17dB gains, respectively, compared with the traditional Fast-SSC-Flip [14] and the newly proposed two-bit-flipping Fast-SSC (Fast-SSC-2Flip-E2) [18] under the same conditions. Compared with the newly proposed partitioned Fast-SSC-Flip (PA-Fast-SSC-Flip) (s=4) [18], the proposed NR-Fast-SSC-Flip-ω (ω=2) decoder can obtain about 0.21dB gain, and the FER performance exceeds the cyclic-redundancy-check (CRC) aided SC-list (CRC-SCL) decoder (L=4).

Design and Measurement of an SFQ OR gate composed of a D Flip-Flop and a Confluence Buffer (D Flip-Flop과 Confluence Buffer로 구성된 단자속 양자 OR gate의 설계와 측정)

  • 정구락;박종혁;임해용;장영록;강준희;한택상
    • Progress in Superconductivity
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    • v.4 no.2
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    • pp.127-131
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    • 2003
  • We have designed and measured an SFQ(Single Flux Quantum) OR gate for a superconducting ALU (Arithmetic Logic Unit). To optimize the circuit, we used WRspice, XIC and Lmeter for simulations and layouts. The OR gate was consisted of a Confluence Buffer and a D Flip-Flop. When a pulse enters into the OR gate, the pulse does not propagate to the other input port because of the Confluence Buffer. A role of D Flip-Flip is expelling the data when the clock is entered into D Flip-Flop. For the measurement of the OR gate operation, we attached three DC/SFQs, three SFQ/DCs and one RS Flip -Flop to the OR gate. DC/SFQ circuits were used to generate the data pulses and clock pulses. Input frequency of 10kHz and 1MHzwere used to generate the SFQ pulses from DC/SFQ circuits. Output data from OR gate moved to RS flip -Flop to display the output on the oscilloscope. We obtained bias margins of the D Flip -Flop and the Confluence Buffer from the measurements. The measured bias margins $\pm$38.6% and $\pm$23.2% for D Flip-Flop and Confluence Buffer, respectively The circuit was measured at the liquid helium temperature.

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A NOTE ON FLIP SYSTEMS

  • Lee, Sung-Seob
    • Honam Mathematical Journal
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    • v.29 no.3
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    • pp.341-350
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    • 2007
  • A dynamical system with a skew-commuting involution map is called a flip system. Every flip system on a subshift of finite type is represented by a pair of matrices, one of which is a permutation matrix. The transposition number of this permutation matrix is studied. We define an invariant, called the flip number, that measures the complexity of a flip system, and prove some results on it. More properties of flips on subshifts of finite type with symmetric adjacency matrices are investigated.

Test Point Insertion with Control Point by Greater Use of Existing Functional Flip-Flops

  • Yang, Joon-Sung;Touba, Nur A.
    • ETRI Journal
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    • v.36 no.6
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    • pp.942-952
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    • 2014
  • This paper presents a novel test point insertion (TPI) method for a pseudo-random built-in self-test (BIST) to reduce the area overhead. Recently, a new TPI method for BISTs was proposed that tries to use functional flip-flops to drive control test points instead of adding extra dedicated flip-flops for driving control points. The replacement rule used in a previous work has limitations preventing some dedicated flip-flops from being replaced by functional flip-flops. This paper proposes a logic cone analysis-based TPI approach to overcome the limitations. Logic cone analysis is performed to find candidate functional flop-flops for replacing dedicated flip-flops. Experimental results indicate that the proposed method reduces the test point area overhead significantly with minimal loss of testability by replacing the dedicated flip-flops.

Development of Atmospheric Pressure Plasma Equipment and It's Application to Flip Chip BGA Manufacturing Process (대기압 플라즈마 설비 개발 및 Flip Chip BGA 제조공정 적용)

  • Lee, Ki-Seok;Ryu, Sun-Joong
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.2
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    • pp.15-21
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    • 2009
  • Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

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Inhibition of c-FLIP by RNAi Enhances Sensitivity of the Human Osteogenic Sarcoma Cell Line U2OS to TRAILInduced Apoptosis

  • Zhang, Ya-Ping;Kong, Qing-Hong;Huang, Ying;Wang, Guan-Lin;Chang, Kwen-Jen
    • Asian Pacific Journal of Cancer Prevention
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    • v.16 no.6
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    • pp.2251-2256
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    • 2015
  • To study effects of cellular FLICE (FADD-like IL-$1{\beta}$-converting enzyme)-inhibitory protein (c-FLIP) inhibition by RNA interference (RNAi) on sensitivity of U2OS cells to tumor necrosis factor (TNF)-related apoptosis-inducing ligand (TRAIL)-induced apoptosis, plasmid pSUPER-c-FLIP-siRNA was constructed and then transfected into U2OS cells. A stable transfection cell clone U2OS/pSUPER-c-FLIP-siRNA was screened from the c-FLIP-siRNA transfected cells. RT-PCR and Western blotting were applied to measure the expression of c-FLIP at the levels of mRNA and protein. The results indicated that the expression of c-FLIP was significantly suppressed by the c-FLIP-siRNA in the cloned U2OS/pSUPER-c-FLIP-siRNA as compared with the control cells of U2OS/pSUPER. The cloned cell line of U2OS/pSUPER-c-FLIP-siRNA was further examined for TRAILinduced cell death and apoptosis in the presence of a pan-antagonist of inhibitor of apoptosis proteins (IAPs) AT406, with or without 4 hrs pretreatment with rocaglamide, an inhibitor of c-FLIP biosynthesis, for 24 hrs. Cell death effects and apoptosis were measured by the methods of MTT assay with 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide and flow cytometry, respectively. The results indicated that TRAIL-induced cell death in U2OS/pSUPER-c-FLIP-siRNA was increased compared with control cells U2OS/pSUPER in the presence or absence of AT406. Flow cytometry indicated that TRAIL-induced cell death effects proceeded through cell apoptosis pathway. However, in the presence of rocaglamide, cell death or apoptotic effects of TRAIL were similar and profound in both cell lines, suggesting that the mechanism of action for both c-FLIP-siRNA and rocaglamide was identical. We conclude that the inhibition of c-FLIP by either c-FLIP-siRNA or rocaglamide can enhance the sensitivity of U2OS to TRAIL-induced apopotosis, suggesting that inhibition of c-FLIP is a good target for anti-cancer therapy.

An Adaptive FLIP-Levelset Hybrid Method for Efficient Fluid Simulation (효율적인 유체 시뮬레이션을 위한 FLIP과 레벨셋의 적응형 혼합 기법)

  • Lim, Jae-Gwang;Kim, Bong-Jun;Hong, Jeong-Mo
    • Journal of the Korea Computer Graphics Society
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    • v.19 no.3
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    • pp.1-11
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    • 2013
  • Fluid Implicit Particle (FLIP) method is used in Visual Effect(VFX) industries frequently because FLIP based simulation show high performance with good visual quality. However in large-scale fluid simulations, the efficiency of FLIP method is low because it requires many particles to represent large volume of water. In this papers, we propose a novel hybrid method of simulating fluids to supplement this drawback. To improve the performance of the FLIP method by reducing the number of particles, particles are deployed inside thin layers of the inner surface of water volume only. The coupling between less-disspative solutions of FLIP method and viscosity solution of level set method is achieved by introducing a new surface reconstruction method motivated by surface reconstruction method[1] and moving least squares(MLS) method[2]. Our hybrid method can generate high quality of water simulations efficiently with various multiscale features.

Flip Error Resistant Stitching in Sensor Network Localization (센서네트워크의 위치추정에 있어 플립오류에 강건한 스티칭 기법)

  • Kwon, Oh-Heum;Park, Sang-Joon;Song, Ha-Joo
    • Journal of KIISE:Information Networking
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    • v.36 no.1
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    • pp.24-33
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    • 2009
  • In patch-and-stitch localization algorithms, a flip error refers to the kind of error in which a patch is stitched to the map as being wrongly reflected. In this paper, we present an anchor-free localization algorithm which tries to detect and prevent flip errors. The flip error prevention is achieved by two filtering mechanisms: the flip-ambiguity test and the flip-conflict detection. We evaluate the performances of proposed techniques though simulations and show that they achieve significant performance improvements.