• Journal of the Korean Society of Radiology
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• v.16 no.7
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• pp.969-974
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• 2022

In order to maximize dynamic range and to minimize image lag in digital X-ray imaging, diminishing residual parasitic capacitance in photodiode in pixels is critically necessary. These requirements are more specifically requested in dynamic X-ray imaging with high frame rate and low image lag for industrial 2D/3D automated X-ray inspection and medical CT imaging. This study proposes duoPIX^TM X-ray imaging sensor for the first time that is composed of reset thin film transistor, readout thin film transistor and photodiode in a pixel. To verify duoPIX^TM X-ray imaging sensor, designing duoPIX^TM pixel and imaging sensor was executed first then X-ray imaging sensor with 105 ㎛ pixel pitch, 347 mm × 430 mm imaging area and 3300 × 4096 pixels (13.5M pixels) was fabricated and evaluated by using module tester and image viewer specifically for duoPIX^TM imaging sensor.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.12
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• pp.1217-1222
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• 2012

A wall flow sensor has been used for feedback flow control and wall shear stress measurement. In this study, we developed a new wall flow sensor by combining the PIV algorithm and the micro image sensor used in an optical mouse. The feasibility of the wall flow sensor was investigated by using simulated fluid flow experiments. Compared with the quadrature signal from imaging devices, the accuracy of the wall flow velocity measurement was improved and the dynamic range increased. In addition, the depth information of particles was also measured by using the defocusing imaging technique.

• Advances in aircraft and spacecraft science
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• v.10 no.1
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• pp.67-82
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• 2023

Linear array imaging sensors are widely used in remote sensing satellites. The final products of an imaging sensor can only be used when they are geometrically, radiometrically, and spectrally calibrated. Therefore, at the first stages of sensor design, a detailed calibration procedure must be carefully planned based on the accuracy requirements. In this paper, focusing on inherent optical distortion, a step-by-step procedure for laboratory geometric calibration of a typical push-broom satellite imaging sensor is simulated. The basis of this work is the simulation of a laboratory procedure in which a linear imager mounted on a rotary table captures images of a pin-hole pattern at different angles. By these images and their corresponding pinhole approximation, the correction function is extracted and applied to the raw images to give the corrected ones. The simulation results illustrate that using this approach, the nonlinear effects of distortion can be minimized and therefore the accuracy of the geometric position of this method on the image screen can be improved to better than the order of sub-pixel. On the other hand, the analyses can be used to proper laboratory facility selection based on the imaging sensor specifications and the accuracy.

• Current Optics and Photonics
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• v.7 no.4
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• pp.398-407
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• 2023

We explored a method to evaluate imaging performance for the optimal assembly of an endoscopic miniature lens and a sensor constituting an imaging module at the distal end of gastrointestinal endoscopy. For the assembly of the imaging module, the image sensor was precisely located at the focal plane when collimated light passed through the endoscopic lens. As another method, the distance between the lens and sensor was adjusted to obtain the highest focus index from images measured the star chart of the International Organization for Standardization (ISO) standard at various positions. We analyzed the slanted-edge modulation transfer function (MTF), corresponding depth of field, and number of line pairs for MTF 50% and 20% at each working distance within the range of 5-100 mm for imaging modules assembled in different ways. Assembly conditions of the imaging module with better MTF performance were defined for each working distance range of 5-30 mm and 30-100 mm, respectively. In addition to the MTF performance, the focus index of each assembled module was also compared. In summary, we examined the performance of imaging modules assembled with different methods within the suggested working distance and tried to establish the optimal assembly protocol.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.5
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.453-456
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• 2009

We present a new generation of imaging colorimeter that ensures improved accuracy and sensitivity for shorter measurement times. The imaging optics is telecentric on the sensor and allows measurements at any distances without additional calibration. A new technology is used to make the color filters and flat densities. Imaging polarimetry at fixed wavelength is also possible with the same instrument.

• Journal of the Korean Society of Radiology
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• v.8 no.7
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• pp.371-376
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• 2014

The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

• Journal of Sensor Science and Technology
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• v.26 no.4
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• pp.245-250
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• 2017

A novel method to implement a birdcage-type receiving coil sensor for use in a magnetic resonance imaging(MRI) system has been demonstrated employing a flexible printed circuit board (FPCB) fabrication technique. Unlike the conventional methods, the two-dimensional shape of the coil sensor is first implemented as a FPCB and then it is attached to the surface of a cylindrical supporting structure to implement the three-dimensional birdcage-type coil sensor. The proposed method is very effective to implement object-specific MRI coil sensors especially for small animal measurements in research and preclinical applications since the existing well-developed FPCB-based techniques can easily meet the requirements on accuracies and costs during coil implement process. The performances of the coil sensor verified through $^1H$ 1.5T MRI measurements for small animals and it showed excellent characteristics by providing a high spatial precision and a high signal-to-noise ratio.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.311-316
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• 2018

An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.

• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2205-2210
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• 2015

Experimental studies have been carried out to study the principle operation of the conductive type wire-mesh tomography sensor and analyse the wire-mesh tomography sensor for the liquid/gas two-phase flow interface and void fraction distribution in a process column. The measurement of the two-phase flows in the process column is based on the cross-sectional local instantaneous conductivity. The sensor consists of two planes of parallel electrode wires with 16 electrodes each and was placed orthogonally with each plane. The sensor electrode wires were made of tinned copper wire with an outer diameter of 0.91 mm which stretched over the sensor fixture. Therefore, this result in the mesh grid size with 5.53×5.53mm². The wire-mesh sensor was tested in a horizontal liquid/gas two-phase flows process column with nominal diameter of 95.6 mm and the sampling frequency of 5882.3529 Hz. The tomogram results show that the wire-mesh tomography provides significant results to represent the void fraction distribution in the process column and estimation error was found in the liquid/gas interface level