• 한국의류산업학회지
• /
• 제11권3호
• /
• pp.474-480
• /
• 2009

The purpose of this study is to prepare the hardness of polyester(PET) fabric by thermal bonding with low melting component of bicomponent fiber and to describe the change of physical properties of thermal bonded PET fabrics. The PET fabrics were prepared with regular PET fiber as warp and bicomponent fiber as weft. The bicomponent fiber of sheath-core type were composed with a regular PET core and low melting PET sheath. The thermal bonding of PET fabric was carried out in pin tenter from 120 to $195^{\circ}C$ temperature range for 60 seconds. In this study, we investigated the physical properties and melting behavior of PET fiber and the effect of the temperature of the pin tenter on the thermal bonding, mechanical properties. Melting peak of warp showed the thermal behavior of general PET fiber. However, melting peak of weft fiber(bicomponent fiber) showed the double melting peak. The thermal bonding of the PET fabric formed at about temperature of lower melting peak. The optimum thermal bonding conditions for PET fabrics was applied at $190{\sim}195^{\circ}C$ for 60seconds by pin tenter. On the other hand, the tensile strength of the PET fabric decreased with an increasing temperature of thermal bonding.

• 설비공학논문집
• /
• 제27권2호
• /
• pp.87-93
• /
• 2015

Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.

• 한국전기전자재료학회논문지
• /
• 제22권8호
• /
• pp.625-631
• /
• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• 한국재료학회지
• /
• 제12권10호
• /
• pp.820-824
• /
• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
• /
• pp.303-304
• /
• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• Journal of Welding and Joining
• /
• 제10권3호
• /
• pp.63-72
• /
• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.50-50
• /
• 2011

The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.

• 한국염색가공학회지
• /
• 제25권2호
• /
• pp.110-117
• /
• 2013

The purpose of this study is to fabricate the flame retardant polyester fabric by thermal bonding with low melting component of flame retardant bicomponent filament(LMFRPC) and to describe the characteristics of thermal bonded fabrics. The fabrics were prepared with flame retardant polyester filaments(FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core wherein the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester of low-melting point. In this study, we investigated the physical properties, melting behavior of filament, the effect of the component of FRP and LMFRPC on the thermal bonding, mechanical properties. Melting peak of LMFRPC showed the double melting peak. The thermal bonding of the fabric formed at lower melting peak temperature of bicomponent filament of LMFRPC. The optimum thermal bonding conditions for fabrics was applied at about $170^{\circ}C$ for 60 seconds by pin tenter. On the other hand, the tensile strength, elongation, and LOI of the fabric increased with an increasing component of FRP of weft.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.785-790
• /
• 2002

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

• 한국섬유공학회:학술대회논문집
• /
• 한국섬유공학회 2003년도 봄 학술발표회 논문집
• /
• pp.146-149
• /
• 2003

There are three major bonding types such as chemical bonding, thermal bonding, mechanical bonding to produce nonwoven fabrics. The development of the past few years has shown that the share of thermally bonded webs is growing steadily. The viability of the thermal bonding process is rooted in the price advantage obtained by lower energy costs. However, the thermal bonding process also obtains the quality requirements of the market place. (omitted)