Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 4 Issue 2 Serial No. 11
- /
- Pages.33-37
- /
- 2005
- /
- 1738-2270(pISSN)
The Development of Fine Pitch Bare-chip Process and Bonding System
미세 피치를 갖는 bare-chip 공정 및 시스템 개발
- Shim Hyoung Sub (Department of Mechanical Eng., Graduate School, Yonsei University) ;
-
Kang Heui Seok
(Korea Institute of Industrial Technology)
;
-
Jeong Hoon
(Korea Institute of Industrial Technology)
;
-
Cho Young June
(Korea Institute of Industrial Technology)
;
- Kim Wan Soo (BiOptro Co.LTD) ;
-
Kang Shin Il
(School of Mechanical Eng., Yonsei University)
- 심형섭 (연세대학교 대학원 기계공학과) ;
-
강희석
(한국생산기술연구원)
;
-
정훈
(한국생산기술연구원)
;
-
조영준
(한국생산기술연구원)
;
- 김완수 ((주)바이옵트로) ;
-
강신일
(연세대학교 기계공학부)
- Published : 2005.06.01
Abstract
Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.