반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

나노크기 실리카를 사용한 반도체용 액상 에폭시 수지 성형재료의 흡습성질

Moisture Absorption Properties of Liquid Type Epoxy Encapsulant with Nano-size Silica for Semiconductor Packaging Materials

  • 김환건 (서경대학교 화학생명공학부)
  • Kim, Whan-Gun (Department of Chemical and Biological Engineering, Seokyeong University)
  • 투고 : 2010.05.25
  • 심사 : 2010.06.15
  • 발행 : 2010.06.30
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초록

The moisture absorption properties such as diffusion coefficient and moisture content ratio of liquid type epoxy resin systems with the filler were investigated. Bisphenol A type and Bisphenol F type epoxy resin, Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these liquid type epoxy encapsulant according to the change of filler size. The temperature of glass transition (Tg) of these epoxy resin systems was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these epoxy resin systems according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these systems were calculated in terms of modified Crank equation based on Ficks' law. An increase of Tg and diffusion coefficient with filler size in these systems can be observed, which are attributed to the increase of free volume with Tg. The change of maximum moisture absorption ratio according to the filler size and filler content cannot be observed; however, the diffusion coefficients of these systems decreased with filler content. The diffusion via free volume is dominant in the epoxy resin systems with low nano-sized filler content; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the liquid type epoxy encapsulant with high nano-sized filler content.

키워드

참고문헌

  1. Manzione, L.T., "Plastic Packaging of Microelectronics Devices," Van Nostrand Reinhold: New York, U.S.A., 1990.
  2. Ogata, M., "Technical Trends in Liquid Encapsulant for Semiconductor Devices", Hitachi Chemical Technical Report, Vol. 39, pp.7-12, 2002.
  3. Yoon, H.G. and Kim, W.G., "Polymer for Electronics", Moonundang, 2001.
  4. Rabindra, N., "Green Nanocomposites for Electronic Packaging", Electronic Components and Technology Conference, pp.793-800, 2009.
  5. Kim, W.G. and Nam, T.Y., "Curing Characteristics of o-Cresol Novolac Epoxy Resin Modified by Bismaleimide", J. Polym. Sci. Part A, Polym. Chem., Vol. 34, pp.957-962. 1996. https://doi.org/10.1002/(SICI)1099-0518(19960430)34:6<957::AID-POLA4>3.0.CO;2-F
  6. Kim, W.G. and Ryu, J. H., "Physical Properties of Epoxy Molding Compound for Semiconductor Encapsulation According to the Coupling Treatment Process Change of Silica", J. Appl. Polym. Sci., Vol. 65, pp.1975-1982, 1997. https://doi.org/10.1002/(SICI)1097-4628(19970906)65:10<1975::AID-APP15>3.0.CO;2-W
  7. Kim, W.G. and Ryu, J.H., "The Change of Physical Properties of Epoxy Molding Compound According to the Change of Softening Point of o-Cresol Novolac Epoxy Resin", J. Korean Chem. Soc., Vol. 40(1), pp.81-86, 1996.
  8. Ryu, J. H., Choi, K.S., and Kim, W.G., "Latent catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation", J. Appl. Polym. Sci., Vol. 96, pp.2287-2299, 2005. https://doi.org/10.1002/app.21001
  9. Kim, W.G., "Cure Properties of Self-Extinghishing Epoxy Resin Systems with Microencapsulated Latent Catalysts for Halogen-Free Semiconductor Packaging materials", J. Appl. Polym. Sci., Vol. 113, pp.408-417, 2009. https://doi.org/10.1002/app.29963
  10. Crank, J.; "the Mathematics of Diffusion 2nd Ed.", Oxford University Press: N.J., U.S.A., 1975.
  11. Bastioli, C., and Romano, G., "Water sorption and mechanical properties of acrylic based composites", J. Materials Sci., Vol. 22, pp.4207-4214, 1987. https://doi.org/10.1007/BF01132010
  12. Vrentas, J.S., Duda, J.L., and Ling, H.C., "Antiplasticization and Volumetric Behavior in Glassy Polymers", Macromolecules, Vol.21, pp.1470-1475. 1988. https://doi.org/10.1021/ma00183a042
  13. Vrentas, J.S. and Vrentas, C.M., "Volumetric Behavior of Glassy Polymer-Penetrant Systems", Macromolecules, Vol.22, pp.2264-2266. 1989. https://doi.org/10.1021/ma00195a046
  14. Braun, T., Hausel, F., Bauer, J., Wittier, O., Mrossko, R., Bouazza, M., Becker, K.-F., Oestermann, U., Koch, M., Bader, V., Minge, C., Aschenbrenner, R., and Reichl, H., "Nano-Particle Enhanced Encapsulants for Improved Humidity Resistance", Electronic Components and Technology Conference, pp.198-206, 2008.
  15. Asaad, J., Gomaa, E., and Bishay, I.K., "Free-volume properties of epoxy composites and its relation to macrostructure properties", Materials Science and Engineering A, Vol. 490, pp.151-156, 2008. https://doi.org/10.1016/j.msea.2008.03.015